{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,28]],"date-time":"2026-03-28T16:42:33Z","timestamp":1774716153247,"version":"3.50.1"},"reference-count":26,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2022YFB4400800"],"award-info":[{"award-number":["2022YFB4400800"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2025,3]]},"DOI":"10.1109\/jssc.2024.3503281","type":"journal-article","created":{"date-parts":[[2024,12,4]],"date-time":"2024-12-04T14:08:39Z","timestamp":1733321319000},"page":"826-837","source":"Crossref","is-referenced-by-count":4,"title":["A 140 dB-DR Light-to-Digital Converter Using Current-Domain Hybrid Zoom for Baseline Cancellation and Interference Compensation"],"prefix":"10.1109","volume":"60","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-0334-2869","authenticated-orcid":false,"given":"Chang","family":"Yao","sequence":"first","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"given":"Zhen","family":"Lu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7084-3757","authenticated-orcid":false,"given":"Liheng","family":"Liu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0005-2045-1313","authenticated-orcid":false,"given":"Yaohua","family":"Pan","sequence":"additional","affiliation":[{"name":"Novosense Microelectronics, Suzhou, China"}]},{"given":"Wenhui","family":"Qin","sequence":"additional","affiliation":[{"name":"Novosense Microelectronics, Suzhou, China"}]},{"given":"Shaoyu","family":"Ma","sequence":"additional","affiliation":[{"name":"Novosense Microelectronics, Suzhou, China"}]},{"given":"Yun","family":"Sheng","sequence":"additional","affiliation":[{"name":"Novosense Microelectronics, Suzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9968-5964","authenticated-orcid":false,"given":"Zhiliang","family":"Hong","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4150-0971","authenticated-orcid":false,"given":"Jiawei","family":"Xu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/2629633"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310316"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746331"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2020.3038046"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MCAS.2018.2849261"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEMBS.2004.1404504"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.2015.2466075"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2009.2033035"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.2015.2476337"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/0169-2607(89)90159-4"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067537"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2012.2200677"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365757"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3335068"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.3002952"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2642205"},{"key":"ref17","volume-title":"High-Sensitivity Pulse. Heart-Rate Sensor for Wearable Health [PDF]","year":"2015"},{"key":"ref18","volume-title":"ADI ADPD103 Datasheet","year":"2015"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2019.2945114"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9063112"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062990"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/CICC53496.2022.9772851"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2020.3001449"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9366035"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2023.3315297"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2892602"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/10903209\/10777019.pdf?arnumber=10777019","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,12,1]],"date-time":"2025-12-01T18:24:36Z","timestamp":1764613476000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10777019\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3]]},"references-count":26,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2024.3503281","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,3]]}}}