{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,25]],"date-time":"2025-09-25T18:06:21Z","timestamp":1758823581183,"version":"3.38.0"},"reference-count":0,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,1]],"date-time":"2025-03-01T00:00:00Z","timestamp":1740787200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"STI2030-Major Projects","award":["2021ZD0202200","2021ZD0202202"],"award-info":[{"award-number":["2021ZD0202200","2021ZD0202202"]}]},{"DOI":"10.13039\/501100003399","name":"Science and Technology Commission of Shanghai Municipality","doi-asserted-by":"publisher","award":["2021SHZDZX"],"award-info":[{"award-number":["2021SHZDZX"]}],"id":[{"id":"10.13039\/501100003399","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62204085"],"award-info":[{"award-number":["62204085"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2025,3]]},"DOI":"10.1109\/jssc.2024.3517337","type":"journal-article","created":{"date-parts":[[2024,12,19]],"date-time":"2024-12-19T19:25:27Z","timestamp":1734636327000},"page":"755-767","source":"Crossref","is-referenced-by-count":1,"title":["A 225-\u03bcW Interference-Tolerant Receiver With Shared Wireless LO and Envelope-Tracking Mixer Achieving -104-dBm Sensitivity"],"prefix":"10.1109","volume":"60","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3386-2646","authenticated-orcid":false,"given":"Heyu","family":"Ren","sequence":"first","affiliation":[{"name":"State Key Laboratory of ASIC and Systems and the Institute of Brain-Inspired Circuits and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6157-0109","authenticated-orcid":false,"given":"Liangjian","family":"Lyu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, East China Normal University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-1656-5439","authenticated-orcid":false,"given":"Binbin","family":"Chen","sequence":"additional","affiliation":[{"name":"State Key Laboratory of ASIC and Systems and the Institute of Brain-Inspired Circuits and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0005-8967-4400","authenticated-orcid":false,"given":"Wenjun","family":"Gong","sequence":"additional","affiliation":[{"name":"State Key Laboratory of ASIC and Systems and the Institute of Brain-Inspired Circuits and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9207-6744","authenticated-orcid":false,"given":"Xing","family":"Wu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, East China Normal University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3157-3464","authenticated-orcid":false,"given":"C.-J.","family":"Richard Shi","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Washington, Seattle, WA, USA"}]}],"member":"263","container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/10903209\/10810369.pdf?arnumber=10810369","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,2,25]],"date-time":"2025-02-25T18:49:21Z","timestamp":1740509361000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10810369\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3]]},"references-count":0,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2024.3517337","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"type":"print","value":"0018-9200"},{"type":"electronic","value":"1558-173X"}],"subject":[],"published":{"date-parts":[[2025,3]]}}}