{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,4]],"date-time":"2025-12-04T10:09:24Z","timestamp":1764842964101,"version":"3.44.0"},"reference-count":27,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62474153","62261160647"],"award-info":[{"award-number":["62474153","62261160647"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"Shenzhen Science and Technology Program","doi-asserted-by":"publisher","award":["KQTD20200909114730003","JCYJ20220530143609020","JCYJ20220818100609021"],"award-info":[{"award-number":["KQTD20200909114730003","JCYJ20220530143609020","JCYJ20220818100609021"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2025,9]]},"DOI":"10.1109\/jssc.2024.3523914","type":"journal-article","created":{"date-parts":[[2025,1,9]],"date-time":"2025-01-09T14:50:21Z","timestamp":1736434221000},"page":"3329-3341","source":"Crossref","is-referenced-by-count":3,"title":["A Hybrid Buck-or-Boost Converter for Fast-Transient and Wide-Voltage-Range Applications With Continuous Output Delivery Current"],"prefix":"10.1109","volume":"60","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-1582-8255","authenticated-orcid":false,"given":"Junyi","family":"Ruan","sequence":"first","affiliation":[{"name":"School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6529-0422","authenticated-orcid":false,"given":"Junmin","family":"Jiang","sequence":"additional","affiliation":[{"name":"Department of Electronic and Electrical Engineering, Southern University of Science and Technology, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-6889-8984","authenticated-orcid":false,"given":"Chenzhou","family":"Ding","sequence":"additional","affiliation":[{"name":"School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, Shenzhen, China"}]},{"given":"Kai","family":"Yuan","sequence":"additional","affiliation":[{"name":"School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9921-3211","authenticated-orcid":false,"given":"Ka Nang","family":"Leung","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1198-9251","authenticated-orcid":false,"given":"Zhiyuan","family":"Chen","sequence":"additional","affiliation":[{"name":"State Key Laboratory of ASIC and System, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3986-137X","authenticated-orcid":false,"given":"Xiaoyang","family":"Zeng","sequence":"additional","affiliation":[{"name":"State Key Laboratory of ASIC and System, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6115-8886","authenticated-orcid":false,"given":"Xun","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, Shenzhen, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063105"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310369"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746300"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2012.6177015"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870322"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3320200"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3165820"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310370"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662460"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454517"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310368"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492409"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/CICC53496.2022.9772861"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067471"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310367"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454536"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIC.2019.8778075"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2022.3210296"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454334"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/CICC60959.2024.10529066"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067408"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454342"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3376251"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3297111"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1007\/b100747"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2556098"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3308781"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/11142458\/10834550.pdf?arnumber=10834550","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,16]],"date-time":"2025-09-16T17:34:04Z","timestamp":1758044044000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10834550\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,9]]},"references-count":27,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2024.3523914","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"type":"print","value":"0018-9200"},{"type":"electronic","value":"1558-173X"}],"subject":[],"published":{"date-parts":[[2025,9]]}}}