{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T16:35:18Z","timestamp":1781886918003,"version":"3.54.5"},"reference-count":33,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T00:00:00Z","timestamp":1754006400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T00:00:00Z","timestamp":1754006400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T00:00:00Z","timestamp":1754006400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62304121"],"award-info":[{"award-number":["62304121"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62125403"],"award-info":[{"award-number":["62125403"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U19B2041"],"award-info":[{"award-number":["U19B2041"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["92164301"],"award-info":[{"award-number":["92164301"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2021ZD0114400"],"award-info":[{"award-number":["2021ZD0114400"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Shanghai Municipal Science and Technology Major Project; in part by Beijing National Research Center for Information Science and Technology"},{"DOI":"10.13039\/501100017582","name":"Beijing National Research Center for Information Science and Technology","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100017582","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"Beijing Advanced Innovation Center for Integrated Circuits","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2025,8]]},"DOI":"10.1109\/jssc.2025.3532654","type":"journal-article","created":{"date-parts":[[2025,2,5]],"date-time":"2025-02-05T13:53:51Z","timestamp":1738763631000},"page":"2981-2994","source":"Crossref","is-referenced-by-count":4,"title":["An Energy-Efficient POSIT Compute-in-Memory Macro for High-Accuracy AI Applications"],"prefix":"10.1109","volume":"60","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8293-8881","authenticated-orcid":false,"given":"Yang","family":"Wang","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaolong","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5530-5416","authenticated-orcid":false,"given":"Yubin","family":"Qin","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhiren","family":"Zhao","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4729-7385","authenticated-orcid":false,"given":"Ruiqi","family":"Guo","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4084-3478","authenticated-orcid":false,"given":"Zhiheng","family":"Yue","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Huiming","family":"Han","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5117-7920","authenticated-orcid":false,"given":"Shaojun","family":"Wei","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6942-4395","authenticated-orcid":false,"given":"Yang","family":"Hu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2309-572X","authenticated-orcid":false,"given":"Shouyi","family":"Yin","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICRA48891.2023.10160968"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV51070.2023.00387"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR52688.2022.01042"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR52729.2023.01218"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067447"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454276"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454308"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3174411"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3330483"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3269148"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3103603"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830487"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3066400"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492476"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067527"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067260"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067779"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3363871"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3354313"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3283418"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3309966"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454567"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454447"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454313"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731762"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454468"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9366061"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3184115"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3299009"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3161005"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS46773.2023.10182007"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3165510"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3134897"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/11095840\/10873364.pdf?arnumber=10873364","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,12,2]],"date-time":"2025-12-02T18:48:29Z","timestamp":1764701309000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10873364\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,8]]},"references-count":33,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2025.3532654","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,8]]}}}