{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T16:12:20Z","timestamp":1759335140254,"version":"build-2065373602"},"reference-count":54,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T00:00:00Z","timestamp":1759276800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T00:00:00Z","timestamp":1759276800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T00:00:00Z","timestamp":1759276800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2019YFB2204701"],"award-info":[{"award-number":["2019YFB2204701"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100014219","name":"National Science Fund for Distinguished Young Scholars","doi-asserted-by":"publisher","award":["62225111"],"award-info":[{"award-number":["62225111"]}],"id":[{"id":"10.13039\/501100014219","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2025,10]]},"DOI":"10.1109\/jssc.2025.3553750","type":"journal-article","created":{"date-parts":[[2025,4,3]],"date-time":"2025-04-03T14:36:12Z","timestamp":1743690972000},"page":"3830-3842","source":"Crossref","is-referenced-by-count":0,"title":["Analysis and Design of Broadband Terahertz Push\u2013Push Frequency Doublers With Second Harmonic Source Tuning"],"prefix":"10.1109","volume":"60","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5616-3202","authenticated-orcid":false,"given":"Shuyang","family":"Li","sequence":"first","affiliation":[{"name":"Department of Electronic Engineering, Tsinghua University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6972-1063","authenticated-orcid":false,"given":"Xingcun","family":"Li","sequence":"additional","affiliation":[{"name":"Sanechips Technology Company Ltd., Chengdu, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8347-5543","authenticated-orcid":false,"given":"Huibo","family":"Wu","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Tsinghua University, Beijing, China"}]},{"given":"Yunfan","family":"Wang","sequence":"additional","affiliation":[{"name":"Michigan Integrated Circuits Laboratory, University of Michigan, Ann Arbor, MI, USA"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-5534-6642","authenticated-orcid":false,"given":"Shouqing","family":"Fu","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Tsinghua University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9523-9094","authenticated-orcid":false,"given":"Xin","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi&#x2019;an, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9542-8709","authenticated-orcid":false,"given":"Wenhua","family":"Chen","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Tsinghua University, Beijing, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365759"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3020291"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2016.2602539"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2023.3279872"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/CICC57935.2023.10121317"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3255109"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731663"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454268"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/CICC57935.2023.10121183"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2018.2884852"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870382"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2016.7508282"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3110210"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JMW.2022.3194062"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2272864"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2755693"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2689031"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3045741"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2217853"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2279779"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2767593"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2690291"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2020.2979715"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2022.3154352"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/rfic54546.2022.9863124"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC49505.2020.9218386"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2243465"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2023.3238765"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2020.2988869"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/BCICTS50416.2021.9682474"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/LMWT.2023.3276170"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/bcicts54660.2023.10310975"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.23919\/EuMIC.2018.8539957"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2019.2951105"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2023.3328031"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2019.8780333"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2732953"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3264531"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067586"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2024.3367882"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2020.3011442"},{"volume-title":"Modeling the Bipolar Transistor","year":"1978","author":"Getreu","key":"ref42"},{"volume-title":"Semiconductor Device Modeling With SPICE","year":"1993","author":"Antognetti","key":"ref43"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/JRPROC.1954.274797"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/PROC.1968.6373"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/INMMIC.2006.283521"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/16.740893"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3091546"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3107428"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2786682"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2471847"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3280324"},{"volume-title":"EM Models With Full 3D Passivation for FEM Simulation","year":"2013","key":"ref53"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2002.801169"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/11183661\/10948275.pdf?arnumber=10948275","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T05:22:26Z","timestamp":1759296146000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10948275\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,10]]},"references-count":54,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2025.3553750","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"type":"print","value":"0018-9200"},{"type":"electronic","value":"1558-173X"}],"subject":[],"published":{"date-parts":[[2025,10]]}}}