{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,26]],"date-time":"2026-09-26T17:04:30Z","timestamp":1790442270354,"version":"4.1.0"},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T00:00:00Z","timestamp":1782864000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62174132"],"award-info":[{"award-number":["62174132"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2026,7]]},"DOI":"10.1109\/jssc.2026.3650801","type":"journal-article","created":{"date-parts":[[2026,1,14]],"date-time":"2026-01-14T20:40:36Z","timestamp":1768423236000},"page":"3497-3511","source":"Crossref","is-referenced-by-count":1,"title":["A Low-Latency 200-Gb\/s PAM-4 Heterogeneous Transceiver for Retimed Pluggable Optics"],"prefix":"10.1109","volume":"61","author":[{"ORCID":"https:\/\/orcid.org\/0009-0008-7062-304X","authenticated-orcid":false,"given":"Ka\u2019nan","family":"Wang","sequence":"first","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Renjie","family":"Tang","sequence":"additional","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shuyi","family":"Xiang","sequence":"additional","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haoran","family":"Yang","sequence":"additional","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuyan","family":"Lv","sequence":"additional","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mengyuan","family":"Guo","sequence":"additional","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yu","family":"Su","sequence":"additional","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chenyao","family":"Cao","sequence":"additional","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-3341-2220","authenticated-orcid":false,"given":"Yukun","family":"He","sequence":"additional","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhouchi","family":"Duan","sequence":"additional","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4463-6129","authenticated-orcid":false,"given":"Xiaoyan","family":"Gui","sequence":"additional","affiliation":[{"name":"Shaanxi Provincial Key Laboratory of Electronic Devices and Advanced Chips, Xi’an Key Laboratory of Micro-Nano Electronics and System Integration, Xi’an Jiaotong University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"The Critical Role of High-Quality Optics in AI Networks","year":"2025"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3435378"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454275"},{"key":"ref4","first-page":"114","article-title":"A 1.41 pJ\/b 224 Gb\/s PAM-4 SerDes receiver with 31 dB loss compensation","volume-title":"IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","volume":"65","author":"Segal"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/CICC60959.2024.10528970"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3109562"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49661.2025.10904800"},{"key":"ref8","first-page":"138","article-title":"A 2.2 pJ\/b 212.5 Gb\/s PAM-4 transceiver with >46 dB reach in 5 nm FinFET","volume-title":"IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","author":"Mostafa"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/OJSSCS.2024.3501975"},{"key":"ref10","first-page":"128","article-title":"A 224-Gb\/s 3-pJ\/b 40-dB insertion loss transceiver in 3-nm FinFET CMOS","volume-title":"IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","author":"Pfaff"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454558"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49661.2025.10904601"},{"key":"ref13","first-page":"1","article-title":"100G and 200G per lane linear drive optics for data center applications","volume-title":"Proc. Opt. Fiber Commun. Conf. (OFC)","author":"Chou"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454509"},{"key":"ref15","first-page":"1","article-title":"Connecting switch to fiber: The energy efficiency challenge","volume-title":"Proc. Opt. Fiber Commun. Conf. (OFC)","author":"Tonietto"},{"key":"ref16","first-page":"594","article-title":"A low-latency 200Gb\/s PAM-4 heterogeneous transceiver in 0.13 \u03bcm SiGe BiCMOS and 28 nm CMOS for retimed pluggable optics","volume-title":"Proc. IEEE Int. Solid-State Circuits Conf. (ISSCC)","author":"Tang"},{"key":"ref17","first-page":"132","article-title":"7.5 a 224 Gb\/s\/wire single-ended PAM-4 transceiver front-end with 29 dB equalization for 800 GbE\/1.6TbE","volume-title":"IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","author":"Luo"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/bcicts.2018.8550977"},{"key":"ref19","first-page":"484","article-title":"A 6 V swing 3.6% THD >40 GHz driver with 4.5x bandwidth extension for a 272 Gb\/s dual-polarization 16-QAM silicon photonic transmitter","volume-title":"IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","author":"Ahmed"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2025.3558331"},{"key":"ref21","first-page":"284","article-title":"A 2.4 pJ\/b 100 Gb\/s 3D-integrated PAM-4 optical transmitter with segmented SiP MOSCAP modulators and a 2-channel 28 nm CMOS driver","volume-title":"IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","volume":"65","author":"Talkhooncheh"},{"key":"ref22","first-page":"208","article-title":"A 3D-integrated microring-based 112 Gb\/s PAM-4 silicon-photonic transmitter with integrated nonlinear equalization and thermal control","volume-title":"IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","author":"Li"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2939081"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3308146"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/CICC60959.2024.10529032"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3057575"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3092747"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ESSERC62670.2024.10719519"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3223052"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/LMWT.2022.3233634"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3025285"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2008.4585955"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/BCICTS48439.2020.9392970"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/cicc51472.2021.9431514"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS46596.2019.8965046"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2019.8701786"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/CICC53496.2022.9772800"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/11589468\/11353444.pdf?arnumber=11353444","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T19:36:55Z","timestamp":1782934615000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11353444\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,7]]},"references-count":37,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2026.3650801","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,7]]}}}