{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,27]],"date-time":"2026-07-27T19:59:16Z","timestamp":1785182356392,"version":"3.55.0"},"reference-count":39,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2026,8,1]],"date-time":"2026-08-01T00:00:00Z","timestamp":1785542400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,8,1]],"date-time":"2026-08-01T00:00:00Z","timestamp":1785542400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,8,1]],"date-time":"2026-08-01T00:00:00Z","timestamp":1785542400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Samsung"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2026,8]]},"DOI":"10.1109\/jssc.2026.3675678","type":"journal-article","created":{"date-parts":[[2026,3,26]],"date-time":"2026-03-26T19:50:15Z","timestamp":1774554615000},"page":"4308-4320","source":"Crossref","is-referenced-by-count":0,"title":["A Hybrid Touch Sensing AFE With Common-CVQ (Currents, Voltages, and Charges) Subtraction to Improve Display Noise Immunity for Large Sensing Load"],"prefix":"10.1109","volume":"61","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-6066-3167","authenticated-orcid":false,"given":"Seung Hun","family":"Choi","sequence":"first","affiliation":[{"name":"Korea University","place":["Seoul, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jun Yeol","family":"An","sequence":"additional","affiliation":[{"name":"Korea University","place":["Seoul, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-8196-1971","authenticated-orcid":false,"given":"Jaewoong","family":"Ahn","sequence":"additional","affiliation":[{"name":"Korea University","place":["Seoul, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Si-Woo","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics Company Ltd.","place":["Hwasung, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jae-Youl","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics Company Ltd.","place":["Hwasung, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-6646-7192","authenticated-orcid":false,"given":"Yoon-Kyung","family":"Choi","sequence":"additional","affiliation":[{"name":"Korea University","place":["Seoul, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1191-3553","authenticated-orcid":false,"given":"Hyung-Min","family":"Lee","sequence":"additional","affiliation":[{"name":"Korea University","place":["Seoul, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373624"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1002\/sdtp.13295"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1002\/sdtp.15406"},{"key":"ref4","article-title":"A circuit modeling method of OLED on-cell touch panels including the touch objects for full-frame touch simulation","volume-title":"Proc. SID Eurodisplay Conf.","author":"Choi"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1002\/sdtp.13912"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2830660"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3279102"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.5573\/JSTS.2024.24.5.473"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2892597"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1002\/sdtp.15719"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2019.8902664"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2023.3333041"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062911"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2898344"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1002\/sdtp.16587"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2015.2423556"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5434080"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2012.2230494"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2014.6757405"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2364092"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6176943"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2014.6858444"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2750326"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3100470"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC58667.2023.10347943"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310245"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454465"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.23919\/VLSITechnologyandCir65189.2025.11075171"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3349190"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2336800"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2945039"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2019.8824937"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2018.2888516"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454341"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067374"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2480094"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC58667.2023.10347984"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/4.340424"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2010.5716570"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/11623245\/11456415.pdf?arnumber=11456415","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,7,27]],"date-time":"2026-07-27T19:01:38Z","timestamp":1785178898000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11456415\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,8]]},"references-count":39,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2026.3675678","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,8]]}}}