{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,23]],"date-time":"2026-10-23T20:17:27Z","timestamp":1792786647531,"version":"4.5.0"},"reference-count":27,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T00:00:00Z","timestamp":1790812800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T00:00:00Z","timestamp":1790812800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T00:00:00Z","timestamp":1790812800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Samsung Advanced Institute of Technology, Samsung Electronics Company Ltd","id":[{"id":"https:\/\/ror.org\/020m7t761","id-type":"ROR","asserted-by":"crossref"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2026,10]]},"DOI":"10.1109\/jssc.2026.3706754","type":"journal-article","created":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T19:36:51Z","timestamp":1782934611000},"page":"5445-5459","source":"Crossref","is-referenced-by-count":0,"title":["A Scalable 1024-Channel VCO-Based CTDSM MEA Readout IC Achieving High Yield and Reliability Through Slot-Partitioned Channel Redundancy"],"prefix":"10.1109","volume":"61","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7335-1117","authenticated-orcid":false,"given":"Hyeok-Ki","family":"Hong","sequence":"first","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Joonseong","family":"Kang","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-9106-5856","authenticated-orcid":false,"given":"Byungsu","family":"Jung","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3167-0440","authenticated-orcid":false,"given":"Nahmil","family":"Koo","sequence":"additional","affiliation":[{"name":"Dankook University","place":["Yongin-si, Gyeonggi-do, South Korea"],"department":["Department of Electronics and Electrical Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Seong-Joong","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hankyu","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6008-1338","authenticated-orcid":false,"given":"Dong-Jin","family":"Chang","sequence":"additional","affiliation":[{"name":"Chungnam National University","place":["Daejeon-si, South Korea"],"department":["Department of Electronics Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mikyung","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Junyeub","family":"Suh","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jonghan","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-8804-6047","authenticated-orcid":false,"given":"Takhyung","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Anes","family":"Ju","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-6015-1986","authenticated-orcid":false,"given":"Jaechun","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-0877-3508","authenticated-orcid":false,"given":"Chang-Woo","family":"Shin","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kitae","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chisung","family":"Bae","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology (SAIT)","place":["Suwon-si, Gyeonggi-do, South Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1101\/2020.10.27.358291"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/s41593-025-01976-5"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.3389\/fnins.2014.00423"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1039\/D5LC00058K"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/s41551-025-01352-5"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1038\/s41551-019-0455-7"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.neuron.2022.09.001"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-023-01069-w"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1002\/advs.202508120"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2863952"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2686580"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2873180"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3005816"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3344798"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2016.2646901"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2019.2942450"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46783.2024.10631430"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492480"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2724025"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.3390\/electronics11213477"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2023.3322901"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3186788"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3140222"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC67472.2025.11349417"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.3390\/electronics12122676"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2009.2018928"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49663.2026.11409263"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/11705693\/11589570.pdf?arnumber=11589570","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,9,28]],"date-time":"2026-09-28T19:06:07Z","timestamp":1790622367000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11589570\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,10]]},"references-count":27,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2026.3706754","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,10]]}}}