{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,26]],"date-time":"2026-06-26T20:45:30Z","timestamp":1782506730455,"version":"3.54.5"},"reference-count":55,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T00:00:00Z","timestamp":1780272000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T00:00:00Z","timestamp":1780272000000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T00:00:00Z","timestamp":1780272000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T00:00:00Z","timestamp":1780272000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["1916760"],"award-info":[{"award-number":["1916760"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"name":"I IUCRC University of Virginia: Center for Hardware and Embedded Systems Security and Trust"},{"name":"Commonwealth Center for Advanced Logistics Systems"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Systems Journal"],"published-print":{"date-parts":[[2026,6]]},"DOI":"10.1109\/jsyst.2026.3689093","type":"journal-article","created":{"date-parts":[[2026,5,21]],"date-time":"2026-05-21T19:43:00Z","timestamp":1779392580000},"page":"528-539","source":"Crossref","is-referenced-by-count":0,"title":["Enterprise Resilience of Semiconductor Supply Chains With Critical Materials and Extreme Weather"],"prefix":"10.1109","volume":"20","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9026-260X","authenticated-orcid":false,"given":"Davis C.","family":"Loose","sequence":"first","affiliation":[{"name":"Department of Systems and Information Engineering, University of Virginia, Charlottesville, VA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0475-8233","authenticated-orcid":false,"given":"Negin","family":"Moghadasi","sequence":"additional","affiliation":[{"name":"Department of Systems and Information Engineering, University of Virginia, Charlottesville, VA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9643-9354","authenticated-orcid":false,"given":"Zachary A.","family":"Collier","sequence":"additional","affiliation":[{"name":"Department of Management, Radford University, Radford, VA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Elvie","family":"Sellers","sequence":"additional","affiliation":[{"name":"Department of Systems and Information Engineering, University of Virginia, Charlottesville, VA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0823-8107","authenticated-orcid":false,"given":"Igor","family":"Linkov","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University, Pittsburgh, PA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0697-8339","authenticated-orcid":false,"given":"James H.","family":"Lambert","sequence":"additional","affiliation":[{"name":"Department of Systems and Information Engineering, University of Virginia, Charlottesville, VA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2024.2387074"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijpe.2024.109172"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s40031-023-00938-4"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/jsyst.2016.2535726"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/jsyst.2024.3396231"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1061\/jitse4.iseng-2347"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/s40171-023-00347-y"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.resconrec.2020.105248"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.coche.2021.100759"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s10669-020-09777-w"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/syscon64521.2025.11014649"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/uemcon59035.2023.10315988"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.18757\/jscms.2023.6986"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1111\/cwe.12569"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1080\/08963568.2024.2317517"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1365\/s43439-024-00125-1"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1111\/risa.12536"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-024-07147-z"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijpe.2023.109125"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.35341\/afet.1361151"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2020.1849844"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.31387\/oscm0510362"},{"key":"ref23","article-title":"The water challenge for semiconductor manufacturing: What needs to be done?","author":"James","year":"2024"},{"key":"ref24","article-title":"How climate change and water stress is risking the semiconductor supply chain","author":"Lepawsky","year":"2024"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.3390\/su15097382"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1787\/6bed616f-en"},{"key":"ref27","first-page":"2581","article-title":"The COVID-19 pandemic and supply chain disruption: An analysis of the semiconductor industrys resilience","volume":"6","author":"Ochonogor","year":"2023","journal-title":"Int. J. Tech. Sci. Res. Eng."},{"key":"ref28","volume-title":"Resilience Engineering: Concepts and Precepts","author":"Hollnagel","year":"2006"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1080\/17517571003763380"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.cirp.2011.03.041"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/jsyst.2014.2363161"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1177\/15485129211067175"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1201\/9781003575054"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1007\/s10729-021-09548-2"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.3390\/ijerph182212262"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1016\/j.eiar.2024.107723"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2024.125681"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijpe.2021.108390"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/access.2021.3139912"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2019.1629670"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.trd.2008.12.004"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.3390\/su8111115"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1016\/j.ecolecon.2024.108225"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2022.108158"},{"key":"ref45","article-title":"3 key actions for supply chains response to climate change","author":"Wheatley","year":"2023"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijdrr.2022.103323"},{"issue":"1","key":"ref47","first-page":"53","article-title":"Managing risk to avoid supply-hcain breakdown","volume":"46","author":"Chopra","year":"2004","journal-title":"MIT Sloan Manage"},{"key":"ref48","article-title":"How exposed is your supply chain to climate risks?","author":"Boyson","year":"2022"},{"key":"ref49","article-title":"Could climate become the weak link in your supply chain?","author":"Woetzel","year":"2020"},{"issue":"1","key":"ref50","first-page":"1250","article-title":"Challenges and strategies in managing supply chain of manufacturing industry","volume":"10","author":"Wankhade","year":"2019","journal-title":"Int. J. Mech. Eng. Technol."},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1080\/17517575.2023.2200767"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1080\/17517575.2013.810784"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2020.1797208"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1016\/j.ress.2015.03.018"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1016\/j.jlp.2011.05.011"}],"container-title":["IEEE Systems Journal"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/4267003\/11570649\/11532951-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4267003\/11570649\/11532951.pdf?arnumber=11532951","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,26]],"date-time":"2026-06-26T19:45:26Z","timestamp":1782503126000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11532951\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,6]]},"references-count":55,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/jsyst.2026.3689093","relation":{},"ISSN":["1932-8184","1937-9234","2373-7816"],"issn-type":[{"value":"1932-8184","type":"print"},{"value":"1937-9234","type":"electronic"},{"value":"2373-7816","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,6]]}}}