{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T11:40:10Z","timestamp":1725709210343},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,2]]},"DOI":"10.1109\/lascas.2013.6519089","type":"proceedings-article","created":{"date-parts":[[2013,5,29]],"date-time":"2013-05-29T20:50:42Z","timestamp":1369860642000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["Managing signal and power integrity using power transmission lines and alternative signaling schemes"],"prefix":"10.1109","author":[{"given":"S.","family":"Telikepalli","sequence":"first","affiliation":[]},{"family":"Sang Kyu Kim","sequence":"additional","affiliation":[]},{"family":"Sung Joo Park","sequence":"additional","affiliation":[]},{"given":"M.","family":"Swaminathan","sequence":"additional","affiliation":[]},{"family":"Youkeun Han","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2013.6523689"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS.2009.5403994"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2011.2159980"},{"key":"7","article-title":"Are power planes necessary for high speed signaling?","author":"huh","year":"0","journal-title":"11-TH2 Proc of DesignCon 2012"},{"key":"6","first-page":"1139","article-title":"Power transmission lines: A new interconnect design to eliminate simultaneous switching noise","author":"engin","year":"2008","journal-title":"Proc Electron Compon Technol Conf"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2012.6457836"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2011.6100248"},{"journal-title":"XA Spartan-6 FPGA Family","year":"0","key":"9"},{"journal-title":"DDR3 SDRAM Unbuffered DIMM Design Specification","year":"2011","key":"8"}],"event":{"name":"2013 IEEE 4th Latin American Symposium on Circuits and Systems (LASCAS)","start":{"date-parts":[[2013,2,27]]},"location":"Cusco","end":{"date-parts":[[2013,3,1]]}},"container-title":["2013 IEEE 4th Latin American Symposium on Circuits and Systems (LASCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6516161\/6518974\/06519089.pdf?arnumber=6519089","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T03:15:36Z","timestamp":1490238936000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6519089\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,2]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/lascas.2013.6519089","relation":{},"subject":[],"published":{"date-parts":[[2013,2]]}}}