{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T09:30:11Z","timestamp":1730280611008,"version":"3.28.0"},"reference-count":29,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,2]]},"DOI":"10.1109\/lascas.2014.6820324","type":"proceedings-article","created":{"date-parts":[[2014,5,30]],"date-time":"2014-05-30T14:59:56Z","timestamp":1401461996000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["Simulation in 3D integration and TSV"],"prefix":"10.1109","author":[{"given":"K.","family":"Weide-Zaage","sequence":"first","affiliation":[]},{"given":"A.","family":"Moujbani","sequence":"additional","affiliation":[]},{"given":"J.","family":"Kludt","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2008.4550074"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.50.05ED02"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/CPMTSYMPJ.2010.5679652"},{"key":"15","article-title":"Thermo mechanical reliability of through-silicon vias in 3D interconnects","author":"lu","year":"2011","journal-title":"Int Reliability Physics Symp (IRPS)"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2011.5784496"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2188400"},{"key":"14","first-page":"1","article-title":"3D LSI technology and reliability issues","author":"tanaka","year":"2011","journal-title":"Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228419"},{"key":"12","first-page":"148","article-title":"Design issues and considerations for lowcost 3D TSV IC technology","author":"plas","year":"2010","journal-title":"Proc IEEE"},{"key":"21","doi-asserted-by":"publisher","DOI":"10.1109\/CPMTSYMPJ.2010.5679983"},{"key":"20","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898525"},{"key":"22","first-page":"21","article-title":"Multi-scale environment for simulation and materials characterization in stress management for 3d ic tsv-based technologies effect of stress on the device characteristics","volume":"1378","author":"sukharev","year":"2010","journal-title":"AIP"},{"key":"23","first-page":"53","article-title":"3D tcad modeling for stress management in through silicon via (TSV) stacks","volume":"1378","author":"xu","year":"2010","journal-title":"American Institue of Physics(AIP)"},{"key":"24","first-page":"121","article-title":"Nanoindentation study of elastic anisotropy of cu single crystals and grains in TSVs","volume":"1378","author":"yeap","year":"2010","journal-title":"American Institue of Physics(AIP)"},{"key":"25","first-page":"138","article-title":"Raman spectroscopy analysis of mechanical stress near cu-TSVs","volume":"1378","author":"wolf","year":"2010","journal-title":"American Institue of Physics (AIP) Vol"},{"key":"26","first-page":"153","article-title":"Stress-induced delamination of through silicon via structures","volume":"1378","author":"ryu","year":"2010","journal-title":"American Institue of Physics(AIP)"},{"key":"27","first-page":"168","article-title":"NanoXCT a high-resolution technique for tsv characterization","volume":"1378","author":"niese","year":"2010","journal-title":"American Institue of Physics(AIP)"},{"key":"28","doi-asserted-by":"publisher","DOI":"10.1109\/IMPACT.2011.6117209"},{"year":"0","key":"29"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.06.115"},{"journal-title":"Design for Reliability Thermomechanical Analyses of Stress in Through Silicon Via","year":"2010","author":"barnat","key":"2"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2011.6131503"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1147\/rd.494.0725"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6248850"},{"year":"0","key":"6"},{"key":"5","first-page":"1190","article-title":"Investigation of thermomigration in composite snpb solder joints","author":"tao","year":"2011","journal-title":"ECTC"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ESIME.2010.5464542"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ICMA.2012.6282818"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2011.5784499"}],"event":{"name":"2014 IEEE 5th Latin American Symposium on Circuits and Systems (LASCAS)","start":{"date-parts":[[2014,2,25]]},"location":"Santiago, Chile","end":{"date-parts":[[2014,2,28]]}},"container-title":["2014 IEEE 5th Latin American Symposium on Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6815880\/6820243\/06820324.pdf?arnumber=6820324","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T15:15:05Z","timestamp":1490282105000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6820324\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,2]]},"references-count":29,"URL":"https:\/\/doi.org\/10.1109\/lascas.2014.6820324","relation":{},"subject":[],"published":{"date-parts":[[2014,2]]}}}