{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T07:21:47Z","timestamp":1725434507049},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,2]]},"DOI":"10.1109\/lascas.2014.6820325","type":"proceedings-article","created":{"date-parts":[[2014,5,30]],"date-time":"2014-05-30T14:59:56Z","timestamp":1401461996000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["Parallel vs. serial inter-plane communication using TSVs"],"prefix":"10.1109","author":[{"given":"Somayyeh Rahimian","family":"Omam","sequence":"first","affiliation":[]},{"given":"Yusuf","family":"Leblebici","sequence":"additional","affiliation":[]},{"given":"Giovanni","family":"De Micheli","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","article-title":"Transition inversion based low power data coding scheme for synchronous serial communication","author":"bharghava","year":"2009","journal-title":"Proc IEEE Computer Society Annual Symposium on VLSI"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/SiPS.2011.6088957"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2010.5457013"},{"journal-title":"Three-Dimensional Integrated Circuit Design","year":"2009","author":"pavlidis","key":"1"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2101890"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ICEAC.2010.5702291"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2012.6271795"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796486"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2009.5416458"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1145\/1973009.1973089"}],"event":{"name":"2014 IEEE 5th Latin American Symposium on Circuits and Systems (LASCAS)","start":{"date-parts":[[2014,2,25]]},"location":"Santiago, Chile","end":{"date-parts":[[2014,2,28]]}},"container-title":["2014 IEEE 5th Latin American Symposium on Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6815880\/6820243\/06820325.pdf?arnumber=6820325","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T14:42:22Z","timestamp":1490280142000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6820325\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,2]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/lascas.2014.6820325","relation":{},"subject":[],"published":{"date-parts":[[2014,2]]}}}