{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,11]],"date-time":"2025-06-11T01:54:58Z","timestamp":1749606898427},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,2]]},"DOI":"10.1109\/lascas.2016.7451047","type":"proceedings-article","created":{"date-parts":[[2016,4,14]],"date-time":"2016-04-14T20:19:48Z","timestamp":1460665188000},"page":"211-214","source":"Crossref","is-referenced-by-count":7,"title":["Solutions for DMM-1 complexity reduction in 3D-HEVC based on gradient calculation"],"prefix":"10.1109","author":[{"given":"Mario","family":"Saldanha","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bruno","family":"Zatt","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Marcelo","family":"Porto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Luciano","family":"Agostini","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gustavo","family":"Sanchez","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.image.2006.11.013"},{"journal-title":"H 265 High Efficiency Video Coding","year":"0","key":"ref3"},{"article-title":"Common test conditions of 3DV experimentation","year":"2012","author":"rusanovskyy","key":"ref10"},{"key":"ref6","article-title":"3D HEVC Test Model 6","author":"zhang","year":"2013","journal-title":"3D-HEVC Test Model Description Draft 1"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICIP.2008.4712288"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LASCAS.2015.7250455"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/VCIP.2014.7051523"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2013.2264820"},{"key":"ref9","article-title":"3D HEVC Test Model 3","author":"tech","year":"2013","journal-title":"3D-HEVC Test Model Description Draft 1"},{"year":"2014","key":"ref1"}],"event":{"name":"2016 IEEE 7th Latin American Symposium on Circuits & Systems (LASCAS)","start":{"date-parts":[[2016,2,28]]},"location":"Florianopolis","end":{"date-parts":[[2016,3,2]]}},"container-title":["2016 IEEE 7th Latin American Symposium on Circuits & Systems (LASCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7447194\/7450986\/07451047.pdf?arnumber=7451047","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,9,30]],"date-time":"2016-09-30T00:18:02Z","timestamp":1475194682000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7451047\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,2]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/lascas.2016.7451047","relation":{},"subject":[],"published":{"date-parts":[[2016,2]]}}}