{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T09:31:09Z","timestamp":1730280669514,"version":"3.28.0"},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,2]]},"DOI":"10.1109\/lascas.2018.8399939","type":"proceedings-article","created":{"date-parts":[[2018,7,30]],"date-time":"2018-07-30T17:45:34Z","timestamp":1532972734000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["An automated methodology to fix electromigration violations on a customized design flow"],"prefix":"10.1109","author":[{"given":"Lucas","family":"de Paris","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ricardo","family":"Reis","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","article-title":"Some limits of power delivery in multicore era","author":"zhang","year":"2012","journal-title":"ISCAS 2012"},{"journal-title":"Addressing signal electromigration (em) in todayâs complex digital designs","year":"2013","author":"geetha","key":"ref11"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/2451916.2451925"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2014.7050077"},{"journal-title":"Cadence","article-title":"Encounter digital implementation system user guide","year":"2015","key":"ref14"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2013.6509650"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-TSA.2013.6545621"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IPFA.2009.5232735"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001395"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2016.7539173"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"800","DOI":"10.1109\/16.491258","article-title":"Modeling and characterization of electromigration failures under bidirectional current stress","volume":"43","author":"tao","year":"1996","journal-title":"IEEE Trans Electron Devices"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/2206781.2206854"},{"journal-title":"ITRS","article-title":"International technology roadmap for seminconductors","year":"2013","key":"ref1"},{"journal-title":"Understand and Avoid Electromigration (EM) & IR-drop in Custom IP Blocks","year":"2011","author":"geden","key":"ref9"}],"event":{"name":"2018 IEEE 9th Latin American Symposium on Circuits & Systems (LASCAS)","start":{"date-parts":[[2018,2,25]]},"location":"Puerto Vallarta","end":{"date-parts":[[2018,2,28]]}},"container-title":["2018 IEEE 9th Latin American Symposium on Circuits & Systems (LASCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8392643\/8399896\/08399939.pdf?arnumber=8399939","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,8,23]],"date-time":"2020-08-23T22:17:45Z","timestamp":1598221065000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8399939\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,2]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/lascas.2018.8399939","relation":{},"subject":[],"published":{"date-parts":[[2018,2]]}}}