{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T18:25:35Z","timestamp":1763749535732,"version":"3.44.0"},"reference-count":14,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Commun. Lett."],"published-print":{"date-parts":[[2025,9]]},"DOI":"10.1109\/lcomm.2025.3584212","type":"journal-article","created":{"date-parts":[[2025,6,30]],"date-time":"2025-06-30T13:38:33Z","timestamp":1751290713000},"page":"2028-2032","source":"Crossref","is-referenced-by-count":1,"title":["Digital Predistortion of Quadrature Digital Power Amplifiers Using RVRTCNN: Real-Valued Residual Temporal Convolutional Neural Network"],"prefix":"10.1109","volume":"29","author":[{"ORCID":"https:\/\/orcid.org\/0009-0003-9391-8653","authenticated-orcid":false,"given":"Jiayu","family":"Yang","sequence":"first","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-1732-6801","authenticated-orcid":false,"given":"Wending","family":"Zhao","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4447-7452","authenticated-orcid":false,"given":"Yicheng","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6976-5699","authenticated-orcid":false,"given":"Wang","family":"Wang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7896-4163","authenticated-orcid":false,"given":"Zixu","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7576-2742","authenticated-orcid":false,"given":"Manni","family":"Li","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-8166-0969","authenticated-orcid":false,"given":"Zijian","family":"Huang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5939-3502","authenticated-orcid":false,"given":"Yinyin","family":"Lin","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3911-8079","authenticated-orcid":false,"given":"Yun","family":"Yin","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1852-4112","authenticated-orcid":false,"given":"Hongtao","family":"Xu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49661.2025.10904580"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2496956"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ASICON47005.2019.8983561"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS48785.2022.9937693"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/RFIT58767.2023.10243257"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2006.879264"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2984682"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2022.3182233"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/LMWT.2023.3263642"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TNNLS.2021.3054867"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3075689"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/LCOMM.2024.3443104"},{"key":"ref13","article-title":"Residual connections encourage iterative inference","author":"Jastrz\u0229bski","year":"2017","journal-title":"arXiv:1710.04773"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3347309"}],"container-title":["IEEE Communications Letters"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4234\/11165211\/11058939.pdf?arnumber=11058939","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,22]],"date-time":"2025-09-22T17:44:40Z","timestamp":1758563080000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11058939\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,9]]},"references-count":14,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/lcomm.2025.3584212","relation":{},"ISSN":["1089-7798","1558-2558","2373-7891"],"issn-type":[{"type":"print","value":"1089-7798"},{"type":"electronic","value":"1558-2558"},{"type":"electronic","value":"2373-7891"}],"subject":[],"published":{"date-parts":[[2025,9]]}}}