{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,19]],"date-time":"2025-12-19T07:20:06Z","timestamp":1766128806675,"version":"3.48.0"},"reference-count":10,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100019445","name":"Shanghai 2024 6G Technology Innovation and Future Industry Development Project","doi-asserted-by":"publisher","award":["24DP1501204"],"award-info":[{"award-number":["24DP1501204"]}],"id":[{"id":"10.13039\/501100019445","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Commun. Lett."],"published-print":{"date-parts":[[2026]]},"DOI":"10.1109\/lcomm.2025.3634546","type":"journal-article","created":{"date-parts":[[2025,11,19]],"date-time":"2025-11-19T18:45:54Z","timestamp":1763577954000},"page":"253-257","source":"Crossref","is-referenced-by-count":0,"title":["Performance Analysis of OFDM\u2013OAM Communications With Delay-Line Feeding Networks"],"prefix":"10.1109","volume":"30","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2718-532X","authenticated-orcid":false,"given":"Wei","family":"Yu","sequence":"first","affiliation":[{"name":"Science and Technology on Microsystem Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-4284-6741","authenticated-orcid":false,"given":"Ding","family":"Chen","sequence":"additional","affiliation":[{"name":"Science and Technology on Microsystem Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-6245-1081","authenticated-orcid":false,"given":"Bin","family":"Zhou","sequence":"additional","affiliation":[{"name":"Chinese Academy of Sciences, Shanghai Institute of Microsystem and Information Technology, Shanghai, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevA.45.8185"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.001.2200977"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/COMST.2019.2952453"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2011.2173142"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2017.2675885"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2023.3313735"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2018.2872169"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2024.3416743"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2016.2515122"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/VTCSpring.2017.8108434"}],"container-title":["IEEE Communications Letters"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4234\/11301808\/11259089.pdf?arnumber=11259089","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,12,19]],"date-time":"2025-12-19T07:16:32Z","timestamp":1766128592000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11259089\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/lcomm.2025.3634546","relation":{},"ISSN":["1089-7798","1558-2558","2373-7891"],"issn-type":[{"type":"print","value":"1089-7798"},{"type":"electronic","value":"1558-2558"},{"type":"electronic","value":"2373-7891"}],"subject":[],"published":{"date-parts":[[2026]]}}}