{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,2,9]],"date-time":"2023-02-09T15:55:43Z","timestamp":1675958143293},"reference-count":23,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2010,12,1]],"date-time":"2010-12-01T00:00:00Z","timestamp":1291161600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Embedded Syst. Lett."],"published-print":{"date-parts":[[2010,12]]},"DOI":"10.1109\/les.2010.2081343","type":"journal-article","created":{"date-parts":[[2010,9,29]],"date-time":"2010-09-29T19:24:49Z","timestamp":1285788289000},"page":"103-106","source":"Crossref","is-referenced-by-count":2,"title":["Thermal-Aware Compilation for Register Window-Based Embedded Processors"],"prefix":"10.1109","volume":"2","author":[{"given":"Mohamed M.","family":"Sabry","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jos\u00e9 L.","family":"Ayala","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David","family":"Atienza","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","year":"0"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/1785481.1785535"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"275","DOI":"10.1145\/780731.780770","article-title":"adapting instruction level parallelism for optimizing leakage in vliw architectures","volume":"38","author":"kim","year":"2003","journal-title":"SIGPLAN Not"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/383082.383091"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2001.991109"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1504\/IJES.2007.016035"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/1159974.1134674"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1228784.1228844"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/1497561.1497569"},{"key":"ref19","first-page":"426","article-title":"temperature-aware compilation for vliw processors","author":"schafer","year":"2007","journal-title":"Proc 13th IEEE Int Conf Embed Real-Time Comput Syst Appl"},{"key":"ref4","first-page":"71","article-title":"performance, energy and thermal considerations for smt and cmp architectures","author":"li","year":"2005","journal-title":"Proc Int Symp High Perform Comput Arch (HPCA)"},{"key":"ref3","year":"2000","journal-title":"Understanding Integrated Circuit Package Power Capabilities"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/1065579.1065633"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681590"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/782814.782831"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2009.2032372"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2006.870340"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/1629911.1630069"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1093\/ietele\/e88-c.4.509"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2008.4484011"},{"key":"ref22","year":"0","journal-title":"The SPARC Architecture Manual Version 8"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2006.73"},{"key":"ref23","year":"0"}],"container-title":["IEEE Embedded Systems Letters"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4563995\/5659701\/05585809.pdf?arnumber=5585809","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,11]],"date-time":"2021-10-11T00:47:43Z","timestamp":1633913263000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5585809\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,12]]},"references-count":23,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/les.2010.2081343","relation":{},"ISSN":["1943-0663","1943-0671"],"issn-type":[{"value":"1943-0663","type":"print"},{"value":"1943-0671","type":"electronic"}],"subject":[],"published":{"date-parts":[[2010,12]]}}}