{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T16:51:45Z","timestamp":1740156705956,"version":"3.37.3"},"reference-count":7,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"BK21 FOUR Project","award":["4199990113966"],"award-info":[{"award-number":["4199990113966"]}]},{"name":"Basic Science Research Program through NRF","award":["NRF-2022R1I1A3069260","2020M3H2A1078119","NRF-2018R1A6A1A03025109","50%"],"award-info":[{"award-number":["NRF-2022R1I1A3069260","2020M3H2A1078119","NRF-2018R1A6A1A03025109","50%"]}]},{"name":"IITP Grant"},{"name":"Korean government MSIT","award":["2021-0-00944","2022-0-01170","RS-2023-00228970","RS-2022-00156389","50%"],"award-info":[{"award-number":["2021-0-00944","2022-0-01170","RS-2023-00228970","RS-2022-00156389","50%"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Embedded Syst. Lett."],"published-print":{"date-parts":[[2023,12]]},"DOI":"10.1109\/les.2023.3298731","type":"journal-article","created":{"date-parts":[[2023,9,25]],"date-time":"2023-09-25T18:21:51Z","timestamp":1695666111000},"page":"206-209","source":"Crossref","is-referenced-by-count":0,"title":["Efficient Partial Weight Update Techniques for Lightweight On-Device Learning on Tiny Flash-Embedded MCUs"],"prefix":"10.1109","volume":"15","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0433-9533","authenticated-orcid":false,"given":"Jisu","family":"Kwon","sequence":"first","affiliation":[{"name":"School of Electronic and Electronic Engineering, Kyungpook National University, Daegu, Republic of Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5560-873X","authenticated-orcid":false,"given":"Daejin","family":"Park","sequence":"additional","affiliation":[{"name":"School of Electronic and Electronic Engineering, Kyungpook National University, Daegu, Republic of Korea"}]}],"member":"263","reference":[{"key":"ref1","first-page":"607","article-title":"Lightweight run-time working memory compression for deployment of deep neural networks on resource-constrained MCUs","volume-title":"Proc. 26th Asia\u2013South Pacific Design Autom. Conf.","author":"Wang"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2022.3210773"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2265894"},{"key":"ref4","first-page":"1","article-title":"On-device training under 256kB memory","volume-title":"Proc. Annu. Conf. Neural Inf. Process. Syst. (NeurIPS)","author":"Lin"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3432261.3439865"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2021.3098166"},{"volume-title":"System on chip architecture tutorial","year":"2023","author":"Mittal","key":"ref7"}],"container-title":["IEEE Embedded Systems Letters"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4563995\/10330165\/10194316.pdf?arnumber=10194316","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T15:53:55Z","timestamp":1709308435000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10194316\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,12]]},"references-count":7,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/les.2023.3298731","relation":{},"ISSN":["1943-0663","1943-0671"],"issn-type":[{"type":"print","value":"1943-0663"},{"type":"electronic","value":"1943-0671"}],"subject":[],"published":{"date-parts":[[2023,12]]}}}