{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,14]],"date-time":"2026-04-14T16:19:01Z","timestamp":1776183541294,"version":"3.50.1"},"reference-count":11,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Key Research and Development Program of China","award":["2023YFB4403200"],"award-info":[{"award-number":["2023YFB4403200"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62271347"],"award-info":[{"award-number":["62271347"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U21A20459"],"award-info":[{"award-number":["U21A20459"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Solid-State Circuits Lett."],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/lssc.2025.3573757","type":"journal-article","created":{"date-parts":[[2025,5,27]],"date-time":"2025-05-27T17:27:49Z","timestamp":1748366869000},"page":"161-164","source":"Crossref","is-referenced-by-count":1,"title":["Two 7\u201313-GHz GaAs-SiGe Four\u2013Channel Beamforming Chiplets With\/Without Metallic Interlayer Shields"],"prefix":"10.1109","volume":"8","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5925-1838","authenticated-orcid":false,"given":"Nengxu","family":"Zhu","sequence":"first","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-2351-4246","authenticated-orcid":false,"given":"Yiting","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Genyin","family":"Ma","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0989-3119","authenticated-orcid":false,"given":"Fanyi","family":"Meng","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2786698"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2015.2504977"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2988501"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2024.3363048"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/tmtt.2024.3349518"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ASICON52560.2021.9620484"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2025.3542097"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3096190"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3501384"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2023.3328482"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3391893"}],"container-title":["IEEE Solid-State Circuits Letters"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8011414\/10804564\/11015932.pdf?arnumber=11015932","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,13]],"date-time":"2025-06-13T05:50:04Z","timestamp":1749793804000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11015932\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/lssc.2025.3573757","relation":{},"ISSN":["2573-9603"],"issn-type":[{"value":"2573-9603","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}