{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,28]],"date-time":"2026-08-28T17:22:28Z","timestamp":1787937748373,"version":"build-2784847793"},"reference-count":12,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Jiashan Fudan Institute"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Solid-State Circuits Lett."],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/lssc.2025.3576393","type":"journal-article","created":{"date-parts":[[2025,6,4]],"date-time":"2025-06-04T17:59:16Z","timestamp":1749059956000},"page":"173-176","source":"Crossref","is-referenced-by-count":3,"title":["A 45-V Auto-Zero-Stabilized Chopper Instrumentation Amplifier With 1.8- \u03bc V Offset, 33.5- \u03bc V Ripple, and 42-V Common-Mode Input Range"],"prefix":"10.1109","volume":"8","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-0939-311X","authenticated-orcid":false,"given":"Jiahao","family":"Wang","sequence":"first","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-8920-3686","authenticated-orcid":false,"given":"Shen","family":"Ye","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-9459-3473","authenticated-orcid":false,"given":"Shiqi","family":"Zhang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9968-5964","authenticated-orcid":false,"given":"Zhiliang","family":"Hong","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4150-0971","authenticated-orcid":false,"given":"Jiawei","family":"Xu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2021921"},{"key":"ref2","volume-title":"INA849 Data Sheet","year":"2021"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2012.6177056"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2012.6177045"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2013.6487688"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7062939"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2011.2175269"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2162923"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2060253"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2197929"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3127462"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49661.2025.10904534"}],"container-title":["IEEE Solid-State Circuits Letters"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8011414\/10804564\/11023545.pdf?arnumber=11023545","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T05:39:33Z","timestamp":1751348373000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11023545\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/lssc.2025.3576393","relation":{},"ISSN":["2573-9603"],"issn-type":[{"value":"2573-9603","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}