{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,25]],"date-time":"2026-04-25T14:51:30Z","timestamp":1777128690858,"version":"3.51.4"},"reference-count":14,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2022YFB4400800"],"award-info":[{"award-number":["2022YFB4400800"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Solid-State Circuits Lett."],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/lssc.2025.3626378","type":"journal-article","created":{"date-parts":[[2025,10,30]],"date-time":"2025-10-30T18:04:41Z","timestamp":1761847481000},"page":"361-364","source":"Crossref","is-referenced-by-count":1,"title":["A 560 \u03bc W, 6 fA\/\u221aHz, 146 dB-DR Ultrasensitive Current Readout Circuit for PWM-Dimming-Tolerant Under-Display Ambient Light Sensors"],"prefix":"10.1109","volume":"8","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2619-9762","authenticated-orcid":false,"given":"Xiuzhi","family":"Zhao","sequence":"first","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7084-3757","authenticated-orcid":false,"given":"Liheng","family":"Liu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"given":"Shi","family":"Chen","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2244-736X","authenticated-orcid":false,"given":"Tianxiang","family":"Qu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7424-0865","authenticated-orcid":false,"given":"Qinjing","family":"Pan","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"given":"Dan","family":"Li","sequence":"additional","affiliation":[{"name":"OPNOUS Smart Sensing & AI Technology, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0005-1880-9697","authenticated-orcid":false,"given":"Gan","family":"Guo","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9968-5964","authenticated-orcid":false,"given":"Zhiliang","family":"Hong","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4150-0971","authenticated-orcid":false,"given":"Jiawei","family":"Xu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"TMD3721 datasheet","year":"2023"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062990"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662507"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2023.3264499"},{"key":"ref5","volume-title":"DDC-114 datasheet","year":"2009"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310316"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2018.2889745"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2810213"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2025.3528962"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2018.2889536"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2013.2262998"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.23919\/VLSITechnologyandCir65189.2025.11075049"},{"key":"ref13","volume-title":"Si Photodiode molded into clear plastic package: S4797-01 datasheet","year":"2023"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/CICC63670.2025.10983397"}],"container-title":["IEEE Solid-State Circuits Letters"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8011414\/10804564\/11222084.pdf?arnumber=11222084","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,11,12]],"date-time":"2025-11-12T18:44:04Z","timestamp":1762973044000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11222084\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/lssc.2025.3626378","relation":{},"ISSN":["2573-9603"],"issn-type":[{"value":"2573-9603","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}