{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,4]],"date-time":"2025-07-04T07:06:23Z","timestamp":1751612783807},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,11,16]],"date-time":"2022-11-16T00:00:00Z","timestamp":1668556800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,11,16]],"date-time":"2022-11-16T00:00:00Z","timestamp":1668556800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,11,16]]},"DOI":"10.1109\/m2vip55626.2022.10041070","type":"proceedings-article","created":{"date-parts":[[2023,2,16]],"date-time":"2023-02-16T23:01:52Z","timestamp":1676588512000},"source":"Crossref","is-referenced-by-count":4,"title":["Development of a Hybrid Haptic Device with High Degree of Motion Decoupling"],"prefix":"10.1109","author":[{"given":"Ruyi","family":"He","sequence":"first","affiliation":[{"name":"Shanghai University,School of Mechatronic Engineering and Automation,Shanghai,China"}]},{"given":"Bing","family":"Zhang","sequence":"additional","affiliation":[{"name":"Shanghai University,School of Mechatronic Engineering and Automation,Shanghai,China"}]},{"given":"Zhuming","family":"Bi","sequence":"additional","affiliation":[{"name":"Purdue University Fort wayne,Depart of Civil and Mechanical Engineering,Fort Wayne,USA"}]},{"given":"Wenjun","family":"Zhang","sequence":"additional","affiliation":[{"name":"University of Saskatchewan,Department of Mechanical Engineering,Saskatoon,Canada"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMECH.2020.3001205"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TOH.2022.3143663"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1186\/s12984-020-00771-6"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.11604\/pamj.2022.41.155.32475"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/WHC.2015.7177711"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.mechmachtheory.2018.06.015"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TOH.2020.2983037"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICIIBMS52876.2021.9651626"},{"key":"ref9","volume-title":"Force Dimension"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.rcim.2010.03.002"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.5194\/ms-12-155-2021"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1177\/0954406220974052"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICIEA.2012.6360916"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.rcim.2006.02.014"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1088\/1742-6596\/2281\/1\/012011"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICMA54519.2022.9856150"}],"event":{"name":"2022 28th International Conference on Mechatronics and Machine Vision in Practice (M2VIP)","location":"Nanjing, China","start":{"date-parts":[[2022,11,16]]},"end":{"date-parts":[[2022,11,18]]}},"container-title":["2022 28th International Conference on Mechatronics and Machine Vision in Practice (M2VIP)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10041021\/10041042\/10041070.pdf?arnumber=10041070","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,2]],"date-time":"2024-03-02T19:03:54Z","timestamp":1709406234000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10041070\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,11,16]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/m2vip55626.2022.10041070","relation":{},"subject":[],"published":{"date-parts":[[2022,11,16]]}}}