{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,9,13]],"date-time":"2023-09-13T18:56:40Z","timestamp":1694631400069},"reference-count":0,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[1980,11,1]],"date-time":"1980-11-01T00:00:00Z","timestamp":341884800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Computer"],"published-print":{"date-parts":[[1980,11]]},"DOI":"10.1109\/mc.1980.1653424","type":"journal-article","created":{"date-parts":[[2007,8,22]],"date-time":"2007-08-22T20:04:20Z","timestamp":1187813060000},"page":"100-103","source":"Crossref","is-referenced-by-count":0,"title":["Workshop Report: Computer Packaging Workshop Explores Impact of LSI"],"prefix":"10.1109","volume":"13","author":[{"family":"Balde","sequence":"first","affiliation":[]}],"member":"263","container-title":["Computer"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/2\/34652\/01653424.pdf?arnumber=1653424","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:56:53Z","timestamp":1642006613000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1653424\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[1980,11]]},"references-count":0,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/mc.1980.1653424","relation":{},"ISSN":["0018-9162"],"issn-type":[{"value":"0018-9162","type":"print"}],"subject":[],"published":{"date-parts":[[1980,11]]}}}