{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T18:53:33Z","timestamp":1780599213329,"version":"3.54.1"},"reference-count":35,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2020,11,1]],"date-time":"2020-11-01T00:00:00Z","timestamp":1604188800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,11,1]],"date-time":"2020-11-01T00:00:00Z","timestamp":1604188800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,11,1]],"date-time":"2020-11-01T00:00:00Z","timestamp":1604188800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Consumer Electron. Mag."],"published-print":{"date-parts":[[2020,11,1]]},"DOI":"10.1109\/mce.2020.2988048","type":"journal-article","created":{"date-parts":[[2020,5,12]],"date-time":"2020-05-12T00:13:03Z","timestamp":1589242383000},"page":"72-83","source":"Crossref","is-referenced-by-count":7,"title":["Trust Issues in Microelectronics: The Concerns and the Countermeasures"],"prefix":"10.1109","volume":"9","author":[{"given":"Tamzidul","family":"Hoque","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Patanjali","family":"SLPSK","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Swarup","family":"Bhunia","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2530092"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2016.7495568"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2014.6855560"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-011-5255-2"},{"key":"ref35","first-page":"1","article-title":"How to measure trust in microelectronics: The metric matters","author":"cruz","year":"0","journal-title":"Proc Des Autom Conf"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176642"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s41635-017-0001-6"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2018.8368630"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687425"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2019.8741031"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-016-5632-y"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-04138-9_28"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/2976749.2978396"},{"key":"ref17","first-page":"51","article-title":"Hardware Trojan detection using path delay fingerprint","author":"jin","year":"0","journal-title":"Proc IEEE Int Workshop on Hardware-Oriented Secur Trust"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2424929"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2014.6855562"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2018.8624854"},{"key":"ref4","article-title":"A look inside Apple's custom GPU for the iPhone","year":"2016"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2018.8342270"},{"key":"ref3","article-title":"The big hack: How China used a tiny chip to infiltrate U.S. companies","year":"2018"},{"key":"ref6","article-title":"Next generation iPhone chips go into production","year":"2018"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2093547"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967054"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2014.2347918"},{"key":"ref7","article-title":"Mass production of iPhones to start in India","year":"2019"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MSPEC.2008.4505310"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2906147"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MCE.2017.2684940"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2727985"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2011.2160627"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2011.5954998"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/2508859.2516654"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/AsianHOST.2018.8607172"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2018.8624727"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1145\/2660267.2660289"}],"container-title":["IEEE Consumer Electronics Magazine"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/5962380\/9212686\/09090969.pdf?arnumber=9090969","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,27]],"date-time":"2022-04-27T17:18:43Z","timestamp":1651079923000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9090969\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,11,1]]},"references-count":35,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/mce.2020.2988048","relation":{},"ISSN":["2162-2248","2162-2256"],"issn-type":[{"value":"2162-2248","type":"print"},{"value":"2162-2256","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,11,1]]}}}