{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,27]],"date-time":"2026-01-27T22:23:11Z","timestamp":1769552591678,"version":"3.49.0"},"reference-count":15,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2014,8,1]],"date-time":"2014-08-01T00:00:00Z","timestamp":1406851200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Des. Test"],"published-print":{"date-parts":[[2014,8]]},"DOI":"10.1109\/mdat.2014.2299535","type":"journal-article","created":{"date-parts":[[2014,1,31]],"date-time":"2014-01-31T17:39:45Z","timestamp":1391189985000},"page":"43-50","source":"Crossref","is-referenced-by-count":4,"title":["Design Considerations for Cooling High Heat Flux IC Chips With Microchannels"],"prefix":"10.1109","volume":"31","author":[{"given":"Satish G.","family":"Kandlikar","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2005.03.017"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2007.906334"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2189925"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2225143"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1115\/1.4006844"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1115\/1.4023574"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2005.1412152"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1080\/01457630304040"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1080\/01457630591003655"},{"key":"ref5","author":"kandlikar","year":"2013","journal-title":"Heat Transfer and Fluid Flow in Minichannels and microchannels2005"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1080\/10407782.2013.826084"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1115\/ICMM2004-2328"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.910957"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2005.1412151"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1115\/ICNMM2006-96227"}],"container-title":["IEEE Design & Test"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6221038\/6873371\/06710118.pdf?arnumber=6710118","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:31:18Z","timestamp":1642005078000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6710118\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,8]]},"references-count":15,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/mdat.2014.2299535","relation":{},"ISSN":["2168-2356","2168-2364"],"issn-type":[{"value":"2168-2356","type":"print"},{"value":"2168-2364","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,8]]}}}