{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T20:36:24Z","timestamp":1740170184148,"version":"3.37.3"},"reference-count":15,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2014,12,1]],"date-time":"2014-12-01T00:00:00Z","timestamp":1417392000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2014,12,1]],"date-time":"2014-12-01T00:00:00Z","timestamp":1417392000000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2014,12,1]],"date-time":"2014-12-01T00:00:00Z","timestamp":1417392000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2014,12,1]],"date-time":"2014-12-01T00:00:00Z","timestamp":1417392000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["CCF-1018205"],"award-info":[{"award-number":["CCF-1018205"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Korea Electronics Technology Institute","award":["International Joint R&D Project program"],"award-info":[{"award-number":["International Joint R&D Project program"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Des. Test"],"published-print":{"date-parts":[[2014,12]]},"DOI":"10.1109\/mdat.2014.2343191","type":"journal-article","created":{"date-parts":[[2014,7,25]],"date-time":"2014-07-25T18:43:23Z","timestamp":1406313803000},"page":"29-37","source":"Crossref","is-referenced-by-count":1,"title":["Millimeter-Wave Wireless Interconnect for 3-D SIC Testing"],"prefix":"10.1109","volume":"31","author":[{"given":"Julia Hsin-Lin","family":"Lu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wing-Fai","family":"Loke","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Byunghoo","family":"Jung","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ASAP.2013.6567554"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2010.5751456"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2150252"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2077130"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2027932"},{"key":"ref15","first-page":"234","article-title":"A 50 mW-TX 65 mW-RX 60 GHz 4-element phased-array transceiver with integrated antennas in 65 nm CMOS","author":"kong","year":"0","journal-title":"IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/RFIT.2011.6141787"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/VDAT.2008.4542472"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2013.6697411"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2013.6702334"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2207900"},{"key":"ref7","article-title":"3D chip package interaction thermo-mechanical challenges: Proximity effects of through silicon vias and $\\mu$-bumps","author":"guo","year":"0","journal-title":"Proc IEEE Int Conf IC Design Technol"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS.2012.6292072"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2011.67"},{"key":"ref9","first-page":"13","article-title":"Signal integrity modeling and measurement of TSV in 3D IC","author":"kim","year":"0","journal-title":"Proc Asia South Pacific Design Automat Conf"}],"container-title":["IEEE Design & Test"],"original-title":[],"link":[{"URL":"http:\/\/ieeexplore.ieee.org\/ielaam\/6221038\/6974939\/6866185-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6221038\/6974939\/06866185.pdf?arnumber=6866185","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,8]],"date-time":"2022-04-08T18:53:20Z","timestamp":1649444000000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6866185\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,12]]},"references-count":15,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/mdat.2014.2343191","relation":{},"ISSN":["2168-2356","2168-2364"],"issn-type":[{"type":"print","value":"2168-2356"},{"type":"electronic","value":"2168-2364"}],"subject":[],"published":{"date-parts":[[2014,12]]}}}