{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,16]],"date-time":"2026-02-16T08:26:13Z","timestamp":1771230373640,"version":"3.50.1"},"reference-count":13,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"the Natural Science Foundation of Anhui Province","award":["2208085J36"],"award-info":[{"award-number":["2208085J36"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62174001, 61904001, 61974001, and 61874156"],"award-info":[{"award-number":["62174001, 61904001, 61974001, and 61874156"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Des. Test"],"published-print":{"date-parts":[[2022,10]]},"DOI":"10.1109\/mdat.2022.3189827","type":"journal-article","created":{"date-parts":[[2022,7,11]],"date-time":"2022-07-11T19:47:00Z","timestamp":1657568820000},"page":"34-42","source":"Crossref","is-referenced-by-count":7,"title":["Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement"],"prefix":"10.1109","volume":"39","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6272-8660","authenticated-orcid":false,"given":"Tianming","family":"Ni","sequence":"first","affiliation":[{"name":"College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4182-0553","authenticated-orcid":false,"given":"Jingchang","family":"Bian","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Hefei University of Technology, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhao","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Hefei University of Technology, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mu","family":"Nie","sequence":"additional","affiliation":[{"name":"College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Liang","family":"Yao","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Hefei University of Technology, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8695-4478","authenticated-orcid":false,"given":"Zhengfeng","family":"Huang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Hefei University of Technology, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0024-987X","authenticated-orcid":false,"given":"Aibin","family":"Yan","sequence":"additional","affiliation":[{"name":"School of Computer Science and Technology, Anhui University, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8305-604X","authenticated-orcid":false,"given":"Xiaoqing","family":"Wen","sequence":"additional","affiliation":[{"name":"Department of Creative Informatics, Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology, Fukuoka, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2775586"},{"key":"ref11","year":"2019","journal-title":"Nangate 45 nm Open Cell Library"},{"key":"ref12","year":"2016","journal-title":"IWLS’05 Benchmark Circuits"},{"key":"ref13","year":"2016","journal-title":"Failure Mechanisms and Models for Semiconductor Devices"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2107924"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2558514"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2228742"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2020.2969237"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2681703"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ITC-Asia.2019.00034"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.2970724"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2017.7927051"}],"container-title":["IEEE Design & Test"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6221038\/9875417\/09825654.pdf?arnumber=9825654","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,10,3]],"date-time":"2022-10-03T20:16:03Z","timestamp":1664828163000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9825654\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10]]},"references-count":13,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/mdat.2022.3189827","relation":{},"ISSN":["2168-2356","2168-2364"],"issn-type":[{"value":"2168-2356","type":"print"},{"value":"2168-2364","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,10]]}}}