{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T20:35:43Z","timestamp":1740170143695,"version":"3.37.3"},"reference-count":24,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Des. Test"],"published-print":{"date-parts":[[2023,10]]},"DOI":"10.1109\/mdat.2023.3261799","type":"journal-article","created":{"date-parts":[[2023,3,24]],"date-time":"2023-03-24T18:31:25Z","timestamp":1679682685000},"page":"52-61","source":"Crossref","is-referenced-by-count":0,"title":["Site-to-Site Variation in Analog Multisite Testing: A Survey on Its Detection and Correction"],"prefix":"10.1109","volume":"40","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2853-4763","authenticated-orcid":false,"given":"Praise O.","family":"Farayola","sequence":"first","affiliation":[{"name":"Iowa State University, Ames, IA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ekaniyere","family":"Oko-Odion","sequence":"additional","affiliation":[{"name":"Iowa State University, Ames, IA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shravan K.","family":"Chaganti","sequence":"additional","affiliation":[{"name":"Texas Instruments Inc., Dallas, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8106-4732","authenticated-orcid":false,"given":"Abalhassan","family":"Sheikh","sequence":"additional","affiliation":[{"name":"Texas Instruments Inc., Dallas, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1306-2361","authenticated-orcid":false,"given":"Srivaths","family":"Ravi","sequence":"additional","affiliation":[{"name":"Texas Instruments Inc., Bengaluru, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5938-6329","authenticated-orcid":false,"given":"Degang","family":"Chen","sequence":"additional","affiliation":[{"name":"Iowa State University, Ames, IA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/DTIS53253.2021.9505144"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.1999.812935"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/DFT56152.2022.9962367"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ITC50671.2022.00062"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2014.6847808"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ETS50041.2021.9465402"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ITC50571.2021.00042"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VTS48691.2020.9107616"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/VTS52500.2021.9794216"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2011.05.022"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-022-06039-2"},{"journal-title":"Site to site variation in parallel test","year":"2022","author":"seng","key":"ref2"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2005.1584053"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2016.7805844"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2016.7805837"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2012.6401595"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ITC50571.2021.00018"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2021.3051666"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2015.7342402"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1080\/00224065.2003.11980232"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICCSN52437.2021.9463617"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ITC50671.2022.00063"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2010.2041775"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2009.2026472"}],"container-title":["IEEE Design &amp; Test"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6221038\/10233150\/10080985.pdf?arnumber=10080985","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,9,18]],"date-time":"2023-09-18T18:05:23Z","timestamp":1695060323000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10080985\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10]]},"references-count":24,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/mdat.2023.3261799","relation":{},"ISSN":["2168-2356","2168-2364"],"issn-type":[{"type":"print","value":"2168-2356"},{"type":"electronic","value":"2168-2364"}],"subject":[],"published":{"date-parts":[[2023,10]]}}}