{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,23]],"date-time":"2026-05-23T06:05:27Z","timestamp":1779516327128,"version":"3.53.1"},"reference-count":12,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T00:00:00Z","timestamp":1780272000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T00:00:00Z","timestamp":1780272000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T00:00:00Z","timestamp":1780272000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62274068"],"award-info":[{"award-number":["62274068"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Des. Test"],"published-print":{"date-parts":[[2026,6]]},"DOI":"10.1109\/mdat.2026.3668137","type":"journal-article","created":{"date-parts":[[2026,2,25]],"date-time":"2026-02-25T20:57:39Z","timestamp":1772053059000},"page":"30-36","source":"Crossref","is-referenced-by-count":0,"title":["Evaluating 3-D Flash Memory Retention Reliability Under Temperature Elevation"],"prefix":"10.1109","volume":"43","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-2778-0839","authenticated-orcid":false,"given":"Yuqian","family":"Pan","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Hubei University, Wuhan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-9806-3559","authenticated-orcid":false,"given":"Runze","family":"Yu","sequence":"additional","affiliation":[{"name":"School of Intelligence Science, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-9251-4046","authenticated-orcid":false,"given":"ZhaoXu","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-1047-5171","authenticated-orcid":false,"given":"Xuepeng","family":"Zhou","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Rui","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1546-3417","authenticated-orcid":false,"given":"Zhenglin","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.est.2022.104811"},{"key":"ref2","volume-title":"Stress-Test-Driven Qualification of Integrated Circuits","year":"2012"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/tps.2009.2029692"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/jeds.2023.3320722"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3659101"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3465332.3470877"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IMW.2017.7939077"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS48227.2022.9764506"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS46773.2023.10181929"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2025.3526055"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC46988.2019.1570552892"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/jeds.2020.2965648"}],"container-title":["IEEE Design & Test"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6221038\/11534137\/11411790.pdf?arnumber=11411790","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,5,23]],"date-time":"2026-05-23T05:19:06Z","timestamp":1779513546000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11411790\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,6]]},"references-count":12,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/mdat.2026.3668137","relation":{},"ISSN":["2168-2356","2168-2364"],"issn-type":[{"value":"2168-2356","type":"print"},{"value":"2168-2364","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,6]]}}}