{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,20]],"date-time":"2025-12-20T22:07:51Z","timestamp":1766268471678},"reference-count":26,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Des. Test. Comput."],"published-print":{"date-parts":[[2012,8]]},"DOI":"10.1109\/mdt.2012.2205609","type":"journal-article","created":{"date-parts":[[2012,6,21]],"date-time":"2012-06-21T19:51:23Z","timestamp":1340308283000},"page":"80-91","source":"Crossref","is-referenced-by-count":10,"title":["Testing of Stuck-Open Faults in Nanometer Technologies"],"prefix":"10.1109","volume":"29","author":[{"given":"Victor","family":"Champac","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Julio","family":"Vazquez Hernandez","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Salvador","family":"Barcelo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Roberto","family":"Gomez","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chuck","family":"Hawkins","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jaume","family":"Segura","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"crossref","first-page":"1748","DOI":"10.1109\/TCAD.2005.852457","article-title":"Diagnosis of resistive and stuck-open defects in digital CMOS ICs","volume":"24","author":"li","year":"2005","journal-title":"IEEE Trans Comput -Aided Design"},{"key":"ref11","article-title":"A novel stuck-at based method for transistor stuck-open fault diagnosis","author":"fan","year":"2005","journal-title":"Int Test Conf"},{"key":"ref12","article-title":"The impacts of untestable defects on transition fault testing","author":"lin","year":"2006","journal-title":"Proc 24th IEEE VLSI Test Symp"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.873892"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2002.807446"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2005.77"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/16.925242"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1049\/el:20072117"},{"key":"ref18","first-page":"63","article-title":"A modern look at the CMOS stuck-open fault","author":"champac","year":"2009","journal-title":"Proc IEEE Latin American Test Workshop"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2009.30"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2008.4700577"},{"key":"ref3","first-page":"337","article-title":"Sub-0.25-micron interconnect scaling: Damascene copper versus substractive aluminum","author":"stamper","year":"1998","journal-title":"Proc IEEE\/SEMI Adv Semiconduct Manufact Conf"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2004.1387403"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2002.1011137"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1989.82325"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1002\/j.1538-7305.1978.tb02106.x"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1002\/0471728527"},{"key":"ref9","doi-asserted-by":"crossref","first-page":"1049","DOI":"10.1109\/TEST.2001.966731","article-title":"Testing for resistive and stuck-opens","author":"li","year":"2001","journal-title":"Int Test Conf"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1998.743133"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2009.33"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/S0038-1101(03)00249-1"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2002.808156"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2011.5763254"},{"key":"ref23","year":"0"},{"key":"ref26","article-title":"Sensitivity of double-gate and FinFET devices to process variations","volume":"50","author":"xiong","year":"2003","journal-title":"IEEE Trans Electron Devices"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1049\/ip-cdt:20045084"}],"container-title":["IEEE Design & Test of Computers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/54\/6327706\/06222408.pdf?arnumber=6222408","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,20]],"date-time":"2017-06-20T16:24:35Z","timestamp":1497975875000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6222408\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,8]]},"references-count":26,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/mdt.2012.2205609","relation":{},"ISSN":["0740-7475"],"issn-type":[{"value":"0740-7475","type":"print"}],"subject":[],"published":{"date-parts":[[2012,8]]}}}