{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,28]],"date-time":"2026-04-28T14:48:04Z","timestamp":1777387684143,"version":"3.51.4"},"reference-count":61,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,21]],"date-time":"2024-10-21T00:00:00Z","timestamp":1729468800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,21]],"date-time":"2024-10-21T00:00:00Z","timestamp":1729468800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001663","name":"VolkswagenStiftung project","doi-asserted-by":"publisher","award":["96632,9B396"],"award-info":[{"award-number":["96632,9B396"]}],"id":[{"id":"10.13039\/501100001663","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100008575","name":"CeTI","doi-asserted-by":"publisher","award":["390696704"],"award-info":[{"award-number":["390696704"]}],"id":[{"id":"10.13039\/100008575","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,21]]},"DOI":"10.1109\/metroxraine62247.2024.10796782","type":"proceedings-article","created":{"date-parts":[[2024,12,24]],"date-time":"2024-12-24T14:09:48Z","timestamp":1735049388000},"page":"1089-1094","source":"Crossref","is-referenced-by-count":1,"title":["Carbon Nanomaterial-Based Memristive Devices for Neuromorphic Applications"],"prefix":"10.1109","author":[{"given":"Luis Antonio","family":"Panes-Ruiz","sequence":"first","affiliation":[{"name":"Institute for Materials Science and Nanotechnology, Max Bergmann Center for Biomaterials, TUD Dresden University of Technology,Dresden,Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shirong","family":"Huang","sequence":"additional","affiliation":[{"name":"Institute for Materials Science and Nanotechnology, Max Bergmann Center for Biomaterials, TUD Dresden University of Technology,Dresden,Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alon","family":"Ascoli","sequence":"additional","affiliation":[{"name":"Politecnico di Torino,Department of Electronics and Telecommunications,Turin,Italy"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ronald","family":"Tetzlaff","sequence":"additional","affiliation":[{"name":"TUD Dresden University of Technology,Chair of Fundamentals of Electrical Engineering,Dresden,Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gianaurelio","family":"Cuniberti","sequence":"additional","affiliation":[{"name":"Institute for Materials Science and Nanotechnology, Max Bergmann Center for Biomaterials, TUD Dresden University of Technology,Dresden,Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/s41563-019-0291-x"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/s41578-019-0159-3"},{"key":"ref3","article-title":"Cramming More Components onto Integrated Circuits","author":"Moore","year":"1965","journal-title":"Electronics Magazine"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.1974.1050511"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-019-08642-y"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/5.58356"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1038\/nature06932"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCT.1971.1083337"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1039\/D0NR02894K"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1002\/aelm.202201195"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1002\/aelm.202370012"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.202300136"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1039\/D1NR00148E"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1038.\/s41586-020-1942-4"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3194465"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3133627"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.3389\/fnins.2021.651452"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3339240"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2023.3339240"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3339535"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3194465"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3133627"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2022.3221156"},{"key":"ref24","article-title":"The Simplest Ever Reported Hodgkin-Huxley Neuristor","author":"Ascoli","journal-title":"Nature, under review"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.201900189"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1038\/s41565-020-0647-z"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-020-0412-1"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1557\/s43577-023-00613-5"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/j.diamond.2022.108858"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201000736"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1016\/j.cclet.2021.03.026"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1021\/ja040082h"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1039\/D0NR02894K"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.apmt.2023.102032"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1016\/j.ccr.2023.215468"},{"key":"ref36","doi-asserted-by":"crossref","first-page":"102032","DOI":"10.1016\/j.apmt.2023.102032","article-title":"Recent advances of carbon dot-based memristors: Mechanisms, devices, and applications","volume":"36","author":"Cao","year":"2024","journal-title":"Applied Materials Today"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1002\/advs.202207229"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1016\/j.orgel.2015.06.040"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1063\/5.0053702"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1039\/D2QM00151A"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1039\/D3MH00117B"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2020.157514"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1039\/D1NA00152C"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1038\/354056a0"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.3390\/s19020392"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1186\/1556-276X-9-393"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1016\/j.chip.2024.100086"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1007\/s11467-021-1114-5"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1016\/j.diamond.2022.108858"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1063\/5.0174426"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1126\/science.1102896"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1038\/nmat1849"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1007\/s11837-022-05505-8"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1038\/ncomms12398"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201306028"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201502574"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6528\/abd978"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1039\/D0CP03822A"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1038\/s41378-020-00189-z"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.1038\/s41427-020-00245-0"},{"key":"ref61","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-022-35160-1"}],"event":{"name":"2024 IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering (MetroXRAINE)","location":"St Albans, United Kingdom","start":{"date-parts":[[2024,10,21]]},"end":{"date-parts":[[2024,10,23]]}},"container-title":["2024 IEEE International Conference on Metrology for eXtended Reality, Artificial Intelligence and Neural Engineering (MetroXRAINE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10795805\/10795809\/10796782.pdf?arnumber=10796782","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,13]],"date-time":"2025-08-13T17:24:48Z","timestamp":1755105888000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10796782\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,21]]},"references-count":61,"URL":"https:\/\/doi.org\/10.1109\/metroxraine62247.2024.10796782","relation":{},"subject":[],"published":{"date-parts":[[2024,10,21]]}}}