{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T20:41:58Z","timestamp":1729629718565,"version":"3.28.0"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,6]]},"DOI":"10.1109\/mixdes.2014.6872219","type":"proceedings-article","created":{"date-parts":[[2014,8,18]],"date-time":"2014-08-18T20:56:23Z","timestamp":1408395383000},"page":"363-366","source":"Crossref","is-referenced-by-count":0,"title":["Design and properties of nanostructured thick-film structures for sensor microelectronics"],"prefix":"10.1109","author":[{"given":"Halyna","family":"Klym","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ivan","family":"Hadzaman","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Iryna","family":"Yurchak","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"17","first-page":"490","article-title":"High-reliable temperature systems for sensor electronics","author":"klym","year":"2012","journal-title":"Proc XIth International Conference Dedicated to the 60th Anniversary of the Radio Department at the Lviv Polytechnic National University \"modern Problem of Radio Engineering Telecommunications and Computer Science"},{"key":"15","first-page":"375","article-title":"Aging of copper-nickel-cobalt manganite NTC thermistors","volume":"1","author":"mrooz","year":"2002","journal-title":"Proc 21st Int Conf Microelectronics"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1016\/S0925-8388(02)00675-8"},{"key":"13","doi-asserted-by":"crossref","DOI":"10.1139\/cjp-2013-0597","article-title":"Multilayer thickfilm structures based on spinel ceramics","volume":"92","author":"klym","year":"2014","journal-title":"Canadian Journal of Physics"},{"key":"14","doi-asserted-by":"crossref","DOI":"10.1186\/1556-276X-9-149","article-title":"Integrated thickfilm nanostructures based on spinel ceramics","author":"klym","year":"2014","journal-title":"Nanoscale Research Letters"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.4028\/www.scientific.net\/SSP.200.156"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1504\/IJNT.2014.063793"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/11\/8\/303"},{"key":"2","first-page":"39","article-title":"Thick-film thermistors printed on LTCC tapes","volume":"80","author":"zhong","year":"2001","journal-title":"Am Ceram Soc Bull"},{"key":"1","first-page":"90","article-title":"New microwave applications for thick-film thermistors","volume":"1","author":"feingold","year":"2000","journal-title":"Microwave Journal"},{"key":"10","doi-asserted-by":"crossref","first-page":"233","DOI":"10.12693\/APhysPolA.117.234","article-title":"Temperature sensitive spinel-type ceramics in thick-film multilayer performance for environment sensors","volume":"117","author":"hadzaman","year":"2010","journal-title":"Acta Physica Polonica A"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1016\/S0921-5107(02)00547-0"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1016\/0925-4005(94)01566-Z"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/8\/1\/011"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/8\/1\/002"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1016\/j.ceramint.2014.01.070"},{"key":"8","doi-asserted-by":"crossref","first-page":"447","DOI":"10.1016\/j.jallcom.2010.09.054","article-title":"Sinteringmofidied mixed Ni-Co-Cu oxymanganospinels for NTC electroceramics","volume":"509","author":"shpotyuk","year":"2011","journal-title":"J Alloys and Compounds"}],"event":{"name":"2014 21st International Conference \"Mixed Design of Integrated Circuits & Systems\" (MIXDES)","start":{"date-parts":[[2014,6,19]]},"location":"Lublin","end":{"date-parts":[[2014,6,21]]}},"container-title":["2014 Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems (MIXDES)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6862970\/6872137\/06872219.pdf?arnumber=6872219","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,8,14]],"date-time":"2019-08-14T03:11:00Z","timestamp":1565752260000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6872219\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,6]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/mixdes.2014.6872219","relation":{},"subject":[],"published":{"date-parts":[[2014,6]]}}}