{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T10:08:12Z","timestamp":1730282892351,"version":"3.28.0"},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,6]]},"DOI":"10.1109\/mixdes.2015.7208531","type":"proceedings-article","created":{"date-parts":[[2015,8,20]],"date-time":"2015-08-20T21:45:09Z","timestamp":1440107109000},"page":"301-304","source":"Crossref","is-referenced-by-count":1,"title":["Custom method for automation of microbolometer design and simulation"],"prefix":"10.1109","author":[{"given":"Mykhaylo","family":"Melnyk","sequence":"first","affiliation":[]},{"given":"Andriy","family":"Kernytskyy","sequence":"additional","affiliation":[]},{"given":"Mykhailo","family":"Lobur","sequence":"additional","affiliation":[]},{"given":"Michal","family":"Szermer","sequence":"additional","affiliation":[]},{"given":"Piotr","family":"Zajac","sequence":"additional","affiliation":[]},{"given":"Cezary","family":"Maj","sequence":"additional","affiliation":[]},{"given":"Wojciech","family":"Zabierowski","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"journal-title":"Wahl Intruments Inc","article-title":"The use of Thermal Imaging in Security Applications","year":"0","key":"ref10"},{"journal-title":"The evolution of thermal imaging Palco Press Spring","year":"2012","key":"ref11"},{"journal-title":"Sensors and Cameras U S Depertmant of Commerce Bureau of Inductry and Security Office of Technology Evaluation","article-title":"Critical Technology Assessment: Night Vision Focal Plane Arrays","year":"2012","key":"ref12"},{"key":"ref13","first-page":"99","article-title":"Analytical Thermo-electric Model of Uncooled Microbolometer","volume":"37","author":"zajac","year":"2013","journal-title":"Machine Dynamics Research"},{"key":"ref14","first-page":"197","article-title":"Perspective Technologies and Methods in MEMS Design","author":"melnyk","year":"2012","journal-title":"Proc of the VIII-th International Conference MEMSTECH 12"},{"key":"ref15","article-title":"Modeling of MEMS Based Bolometer for Measuring Radiations from Nuclear Power Plant","author":"nisitha","year":"0","journal-title":"Excerpt from the Proceedings of the 2013 COMSOL Conference in Bangalore"},{"journal-title":"Micro-bolometer Design and Simulation Coventor","year":"2014","key":"ref16"},{"journal-title":"Comparison of numerical analysis software","year":"0","key":"ref17"},{"journal-title":"Mathcad Mathematica and Maple Intelligent Systems Reference Library","article-title":"Anastassiou, George A, Itan, Iuliana, Intelligent Routines: Solving Mathematical Analysis with Matlab","year":"2013","key":"ref18"},{"journal-title":"Energy-efficient window to solve ventilation and heat loss problems in old buildings","year":"2014","key":"ref4"},{"journal-title":"Home Energy Heat Loss Information Simulation Software and Energy Audit","year":"0","key":"ref3"},{"journal-title":"Proper Use and Deployment of Thermal Image Cameras","year":"2004","author":"johnson","key":"ref6"},{"journal-title":"Thermal imaging guidebook for building and renewable energy applications","article-title":"FLIR Systems AB and the Infrared Training Center (ITC)","year":"2011","key":"ref5"},{"journal-title":"Technical Note","article-title":"FLIR Commercial Vision Systems B.V., Uncooled detectors for thermal imaging cameras","year":"2014","key":"ref8"},{"key":"ref7","article-title":"Application of Application of Digital Thermal Imaging Cameras for Environmental Analysis","author":"landress","year":"0","journal-title":"TAEP - ECIC 2009"},{"journal-title":"Browser Features Comparison","article-title":"HeatCAD®","year":"2014","key":"ref2"},{"journal-title":"Home Heat Loss","article-title":"Haringey Council","year":"2015","key":"ref1"},{"journal-title":"DARPA developing personal LWIR cameras to give soldiers heat vision","year":"2013","author":"szondy","key":"ref9"}],"event":{"name":"2015 MIXDES - 22nd International Conference \"Mixed Design of Integrated Circuits & Systems\"","start":{"date-parts":[[2015,6,25]]},"location":"Torun, Poland","end":{"date-parts":[[2015,6,27]]}},"container-title":["2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7168332\/7208464\/07208531.pdf?arnumber=7208531","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T22:48:54Z","timestamp":1490395734000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7208531\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,6]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/mixdes.2015.7208531","relation":{},"subject":[],"published":{"date-parts":[[2015,6]]}}}