{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T10:37:36Z","timestamp":1725705456419},"reference-count":19,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,6]]},"DOI":"10.1109\/mixdes.2016.7529743","type":"proceedings-article","created":{"date-parts":[[2016,8,4]],"date-time":"2016-08-04T16:27:52Z","timestamp":1470328072000},"page":"257-261","source":"Crossref","is-referenced-by-count":5,"title":["Coupled thermo-fluidic simulation for design space exploration of microchannels in liquid-cooled 3D ICs"],"prefix":"10.1109","author":[{"given":"Piotr","family":"Zajac","sequence":"first","affiliation":[]},{"given":"Cezary","family":"Maj","sequence":"additional","affiliation":[]},{"given":"Melvin","family":"Galicia","sequence":"additional","affiliation":[]},{"given":"Andrzej","family":"Napieralski","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1115\/1.4002287"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2008.4546911"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5653749"},{"key":"ref13","article-title":"Multiphysics Modeling Using COMSOL: A First Principles Approach","author":"pryor","year":"2009","journal-title":"Jones & Bartlett Learning"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424253"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1063\/1.3657897"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2008.4544386"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2005.859612"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1115\/1.4027175"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/966747.966750"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2014.7152146"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISAPM.2011.6105753"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/VLSISOC.2009.6041327"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1115\/1.1839582"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1115\/1.2724850"},{"key":"ref7","first-page":"1","article-title":"Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries","author":"sridhar","year":"2010","journal-title":"Thermal Investigations of ICs and Systems (THERMINIC) 2010 16th International Workshop on"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-0784-4"},{"key":"ref1","article-title":"Design of 3d Integrated Circuits and Systems","author":"sharma","year":"2014","journal-title":"CRC Press"},{"year":"0","key":"ref9"}],"event":{"name":"2016 MIXDES - 23rd International Conference \"Mixed Design of Integrated Circuits and Systems\"","start":{"date-parts":[[2016,6,23]]},"location":"Lodz, Poland","end":{"date-parts":[[2016,6,25]]}},"container-title":["2016 MIXDES - 23rd International Conference Mixed Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7523589\/7529685\/07529743.pdf?arnumber=7529743","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,9,25]],"date-time":"2016-09-25T22:30:56Z","timestamp":1474842656000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7529743\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,6]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/mixdes.2016.7529743","relation":{},"subject":[],"published":{"date-parts":[[2016,6]]}}}