{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T00:19:13Z","timestamp":1760141953547,"version":"build-2065373602"},"reference-count":26,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,9,8]],"date-time":"2025-09-08T00:00:00Z","timestamp":1757289600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,9,8]],"date-time":"2025-09-08T00:00:00Z","timestamp":1757289600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,9,8]]},"DOI":"10.1109\/mlcad65511.2025.11189189","type":"proceedings-article","created":{"date-parts":[[2025,10,9]],"date-time":"2025-10-09T17:51:22Z","timestamp":1760032282000},"page":"1-8","source":"Crossref","is-referenced-by-count":0,"title":["Fast Chip Transient Temperature Simulation via Machine Learning"],"prefix":"10.1109","author":[{"given":"Mohammadamin","family":"Hajikhodaverdian","sequence":"first","affiliation":[{"name":"Boston University,Dept. of Electrical & Computer Engineering,Boston,MA,USA"}]},{"given":"Sherief","family":"Reda","sequence":"additional","affiliation":[{"name":"Brown University,School of Engineering,Providence,RI,USA"}]},{"given":"Ayse K.","family":"Coskun","sequence":"additional","affiliation":[{"name":"Boston University,Dept. of Electrical & Computer Engineering,Boston,MA,USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2015.7112712"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.879797"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2013.2259174"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247666"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3309544"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2002.808009"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3079166"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3051250"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2019.8757412"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.23919\/DATE64628.2025.10993231"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-DAT54769.2022.9768082"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/3676536.3676738"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC52403.2022.9712583"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3394885.3431583"},{"article-title":"Steady-state temperature prediction based on compact thermal models using machine learning","volume-title":"2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","author":"Hajikhodaverdian","key":"ref16"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD57390.2023.10323817"},{"key":"ref18","first-page":"1","article-title":"Full-chip thermal map estimation for commercial multi-core cpus with generative adversarial learning","author":"Jin","year":"2020","journal-title":"2020 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2021.3086112"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/3551901.3556484"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.23919\/SEMI-THERM50369.2020.9142855"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1007\/s00332-015-9258-5"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228475"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1177\/109434209100500306"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1145\/2063384.2063454"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"}],"event":{"name":"2025 ACM\/IEEE 7th Symposium on Machine Learning for CAD (MLCAD)","start":{"date-parts":[[2025,9,8]]},"location":"Santa Cruz, CA, USA","end":{"date-parts":[[2025,9,10]]}},"container-title":["2025 ACM\/IEEE 7th Symposium on Machine Learning for CAD (MLCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11189084\/11189054\/11189189.pdf?arnumber=11189189","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,10]],"date-time":"2025-10-10T05:24:37Z","timestamp":1760073877000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11189189\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,9,8]]},"references-count":26,"URL":"https:\/\/doi.org\/10.1109\/mlcad65511.2025.11189189","relation":{},"subject":[],"published":{"date-parts":[[2025,9,8]]}}}