{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,11]],"date-time":"2025-11-11T21:31:23Z","timestamp":1762896683680},"reference-count":0,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2018,5,1]],"date-time":"2018-05-01T00:00:00Z","timestamp":1525132800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Micro"],"published-print":{"date-parts":[[2018,5]]},"DOI":"10.1109\/mm.2018.032271055","type":"journal-article","created":{"date-parts":[[2018,5,11]],"date-time":"2018-05-11T19:18:15Z","timestamp":1526066295000},"page":"4-4","source":"Crossref","is-referenced-by-count":1,"title":["Top Picks"],"prefix":"10.1109","volume":"38","author":[{"given":"Lieven","family":"Eeckhout","sequence":"first","affiliation":[{"name":"Ghent University"}]}],"member":"263","container-title":["IEEE Micro"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/40\/8357988\/08357990.pdf?arnumber=8357990","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,4]],"date-time":"2022-05-04T19:54:29Z","timestamp":1651694069000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8357990\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,5]]},"references-count":0,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/mm.2018.032271055","relation":{},"ISSN":["0272-1732","1937-4143"],"issn-type":[{"value":"0272-1732","type":"print"},{"value":"1937-4143","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,5]]}}}