{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,25]],"date-time":"2026-03-25T10:53:25Z","timestamp":1774436005666,"version":"3.50.1"},"reference-count":10,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2021,7,1]],"date-time":"2021-07-01T00:00:00Z","timestamp":1625097600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,7,1]],"date-time":"2021-07-01T00:00:00Z","timestamp":1625097600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,7,1]],"date-time":"2021-07-01T00:00:00Z","timestamp":1625097600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Micro"],"published-print":{"date-parts":[[2021,7,1]]},"DOI":"10.1109\/mm.2021.3061335","type":"journal-article","created":{"date-parts":[[2021,2,23]],"date-time":"2021-02-23T21:20:05Z","timestamp":1614115205000},"page":"67-73","source":"Crossref","is-referenced-by-count":20,"title":["On-Demand Mobile CPU Cooling With Thin-Film Thermoelectric Array"],"prefix":"10.1109","volume":"41","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3226-4479","authenticated-orcid":false,"given":"Hammam","family":"Kattan","sequence":"first","affiliation":[{"name":"Karlsruhe Institute of Technology, Karlsruhe, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5347-9586","authenticated-orcid":false,"given":"Sung Woo","family":"Chung","sequence":"additional","affiliation":[{"name":"Korea University, Seoul, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9602-2922","authenticated-orcid":false,"given":"Jorg","family":"Henkel","sequence":"additional","affiliation":[{"name":"Karlsruhe Institute of Technology, Karlsruhe, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5649-3102","authenticated-orcid":false,"given":"Hussam","family":"Amrouch","sequence":"additional","affiliation":[{"name":"University of Stuttgart, Stuttgart, Germany"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2017.8009199"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/3296957.3173188"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2757505"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2013.2273873"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2017.2695958"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1002\/9781118848944"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2008.417"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2018.2848276"},{"key":"ref9","article-title":"Thermoelectrics Handbook: Macro to Nano","author":"rowe","year":"2005"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2019.2916869"}],"container-title":["IEEE Micro"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/40\/9472926\/09361095.pdf?arnumber=9361095","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T14:50:45Z","timestamp":1652194245000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9361095\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,7,1]]},"references-count":10,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/mm.2021.3061335","relation":{},"ISSN":["0272-1732","1937-4143"],"issn-type":[{"value":"0272-1732","type":"print"},{"value":"1937-4143","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,7,1]]}}}