{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,31]],"date-time":"2026-01-31T03:31:44Z","timestamp":1769830304770,"version":"3.49.0"},"reference-count":12,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2022,11,1]],"date-time":"2022-11-01T00:00:00Z","timestamp":1667260800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,11,1]],"date-time":"2022-11-01T00:00:00Z","timestamp":1667260800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-009"},{"start":{"date-parts":[[2022,11,1]],"date-time":"2022-11-01T00:00:00Z","timestamp":1667260800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-001"}],"funder":[{"name":"DARPA 3DSoC Program"},{"DOI":"10.13039\/100015269","name":"Stanford SystemX Alliance","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100015269","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Micro"],"published-print":{"date-parts":[[2022,11,1]]},"DOI":"10.1109\/mm.2022.3202254","type":"journal-article","created":{"date-parts":[[2022,11,4]],"date-time":"2022-11-04T01:39:02Z","timestamp":1667525942000},"page":"116-124","source":"Crossref","is-referenced-by-count":28,"title":["Three-Dimensional Stacked Neural Network Accelerator Architectures for AR\/VR Applications"],"prefix":"10.1109","volume":"42","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6684-7069","authenticated-orcid":false,"given":"Lita","family":"Yang","sequence":"first","affiliation":[{"name":"Reality Labs, Meta, Sunnyvale, CA, USA"}]},{"given":"Robert","family":"Radway","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta, Sunnyvale, CA, USA"}]},{"given":"Yu-Hsin","family":"Chen","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta, Sunnyvale, CA, USA"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2187-0473","authenticated-orcid":false,"given":"Tony","family":"Wu","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta, Sunnyvale, CA, USA"}]},{"given":"Huichu","family":"Liu","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta, Sunnyvale, CA, USA"}]},{"given":"Elnaz","family":"Ansari","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta, Sunnyvale, CA, USA"}]},{"given":"Vikas","family":"Chandra","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta, Sunnyvale, CA, USA"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5572-5194","authenticated-orcid":false,"given":"Subhasish","family":"Mitra","sequence":"additional","affiliation":[{"name":"Stanford University, Stanford, CA, USA"}]},{"given":"Edith","family":"Beigne","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta, Sunnyvale, CA, USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9720526"},{"key":"ref2","article-title":"Computational and technology directions for augmented reality systems","volume-title":"Proc. IEEE Symp. VLSI Circuits, Plenary","author":"Rabii"},{"key":"ref3","article-title":"3D Stacking opportunities for augmented reality hardware systems","volume-title":"Proc. IEEE DATE","author":"Beign\u00e9"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586229"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/CICC53496.2022.9772810"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3352460.3358302"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.90"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2018.00474"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/WACVW54805.2022.00078"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TPAMI.2020.2983686"},{"key":"ref11","article-title":"Temporally consistent online depth estimation in dynamic scenes","author":"Li","year":"2021"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR46437.2021.00909"}],"container-title":["IEEE Micro"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/40\/9933375\/09933882.pdf?arnumber=9933882","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T04:10:17Z","timestamp":1706069417000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9933882\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,11,1]]},"references-count":12,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/mm.2022.3202254","relation":{},"ISSN":["0272-1732","1937-4143"],"issn-type":[{"value":"0272-1732","type":"print"},{"value":"1937-4143","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,11,1]]}}}