{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:10:36Z","timestamp":1740132636946,"version":"3.37.3"},"reference-count":0,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-009"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-001"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Micro"],"published-print":{"date-parts":[[2023,1,1]]},"DOI":"10.1109\/mm.2022.3229244","type":"journal-article","created":{"date-parts":[[2023,1,12]],"date-time":"2023-01-12T21:28:50Z","timestamp":1673558930000},"page":"40-41","source":"Crossref","is-referenced-by-count":0,"title":["Special Issue on Cool Chips"],"prefix":"10.1109","volume":"43","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-8966-867X","authenticated-orcid":false,"given":"Ryusuke","family":"Egawa","sequence":"first","affiliation":[{"name":"Tokyo Denki University, Tokyo, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5489-0964","authenticated-orcid":false,"given":"Yasutaka","family":"Wada","sequence":"additional","affiliation":[{"name":"Meisei University, Tokyo, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","container-title":["IEEE Micro"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/40\/10015900\/10015905.pdf?arnumber=10015905","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,1,13]],"date-time":"2023-01-13T22:07:09Z","timestamp":1673647629000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10015905\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,1,1]]},"references-count":0,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/mm.2022.3229244","relation":{},"ISSN":["0272-1732","1937-4143"],"issn-type":[{"type":"print","value":"0272-1732"},{"type":"electronic","value":"1937-4143"}],"subject":[],"published":{"date-parts":[[2023,1,1]]}}}