{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,15]],"date-time":"2025-04-15T06:14:41Z","timestamp":1744697681390,"version":"3.37.3"},"reference-count":12,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Micro"],"published-print":{"date-parts":[[2024,1]]},"DOI":"10.1109\/mm.2023.3330169","type":"journal-article","created":{"date-parts":[[2023,11,6]],"date-time":"2023-11-06T19:20:37Z","timestamp":1699298437000},"page":"28-37","source":"Crossref","is-referenced-by-count":1,"title":["COOL-NPU: Complementary Online Learning Neural Processing Unit"],"prefix":"10.1109","volume":"44","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1783-5296","authenticated-orcid":false,"given":"Sangyeob","family":"Kim","sequence":"first","affiliation":[{"name":"Korea Advanced Institute of Science and Technology, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7049-9191","authenticated-orcid":false,"given":"Soyeon","family":"Kim","sequence":"additional","affiliation":[{"name":"Korea Advanced Institute of Science and Technology, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-8891-735X","authenticated-orcid":false,"given":"Seongyon","family":"Hong","sequence":"additional","affiliation":[{"name":"Korea Advanced Institute of Science and Technology, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6665-9973","authenticated-orcid":false,"given":"Sangjin","family":"Kim","sequence":"additional","affiliation":[{"name":"Korea Advanced Institute of Science and Technology, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1922-0612","authenticated-orcid":false,"given":"Jiwon","family":"Choi","sequence":"additional","affiliation":[{"name":"Korea Advanced Institute of Science and Technology, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5212-2072","authenticated-orcid":false,"given":"Donghyeon","family":"Han","sequence":"additional","affiliation":[{"name":"Massachusetts Institute of Technology, Cambridge, MA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6661-4879","authenticated-orcid":false,"given":"Hoi-Jun","family":"Yoo","sequence":"additional","affiliation":[{"name":"Korea Advanced Institute of Science and Technology, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/tnnls.2021.3095724"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/tpami.2021.3114196"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/tnnls.2021.3111897"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1609\/aaai.v35i12.17265"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/vlsic.2018.8502423"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2021.3052885"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2019.2942367"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731795"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2021.3066400"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/coolchips57690.2023.10121940"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662302"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2021.3066572"}],"container-title":["IEEE Micro"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/40\/10433868\/10310021.pdf?arnumber=10310021","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,2]],"date-time":"2024-03-02T14:12:17Z","timestamp":1709388737000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10310021\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,1]]},"references-count":12,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/mm.2023.3330169","relation":{},"ISSN":["0272-1732","1937-4143"],"issn-type":[{"type":"print","value":"0272-1732"},{"type":"electronic","value":"1937-4143"}],"subject":[],"published":{"date-parts":[[2024,1]]}}}