{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,5]],"date-time":"2026-03-05T16:07:43Z","timestamp":1772726863048,"version":"3.50.1"},"reference-count":12,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Micro"],"published-print":{"date-parts":[[2025,1]]},"DOI":"10.1109\/mm.2024.3451532","type":"journal-article","created":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T17:49:38Z","timestamp":1725644978000},"page":"16-25","source":"Crossref","is-referenced-by-count":4,"title":["UCIe: Standard for an Open Chiplet Ecosystem"],"prefix":"10.1109","volume":"45","author":[{"given":"Peter","family":"Onufryk","sequence":"first","affiliation":[{"name":"Intel Corporation, Hudson, MA, USA"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-7742-6163","authenticated-orcid":false,"given":"Swadesh","family":"Choudhary","sequence":"additional","affiliation":[{"name":"Intel Corporation, Santa Clara, CA, USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731107"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/isca52012.2021.00014"},{"issue":"3","key":"ref3","doi-asserted-by":"crossref","first-page":"244","DOI":"10.1038\/s41928-024-01126-y","article-title":"High-performance, power-efficient three-dimensional System-in-Package designs with Universal Chiplet Interconnect Express","volume":"7","author":"Das Sharma","year":"2024","journal-title":"Nature Electron."},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/mc.2023.3318769"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/tcpmt.2022.3207195"},{"key":"ref6","volume-title":"Universal Chiplet Interconnect Express (UCIe) Specification Rev 1.1","year":"2023"},{"key":"ref7","volume-title":"Compute Express Link 3.0 Specification","year":"2024"},{"key":"ref8","volume-title":"PCI Express Base Specification Revision 6.2.","year":"2024"},{"key":"ref9","volume-title":"Synopsys UCIe IP solutions","year":"2024"},{"key":"ref10","volume-title":"Universal Chiplet Interconnect Express (UCIe) PHY and Controller","year":"2024"},{"key":"ref11","volume-title":"Does this chip hold the future of the semiconductor industry?","year":"2024"},{"key":"ref12","volume-title":"Ecosystem collaboration drives new AMBA specification for Chiplets","year":"2024"}],"container-title":["IEEE Micro"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/40\/10916411\/10669138.pdf?arnumber=10669138","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,7]],"date-time":"2025-03-07T18:39:33Z","timestamp":1741372773000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10669138\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,1]]},"references-count":12,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/mm.2024.3451532","relation":{},"ISSN":["0272-1732","1937-4143"],"issn-type":[{"value":"0272-1732","type":"print"},{"value":"1937-4143","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,1]]}}}