{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,5]],"date-time":"2026-03-05T16:07:41Z","timestamp":1772726861611,"version":"3.50.1"},"reference-count":10,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Micro"],"published-print":{"date-parts":[[2025,1]]},"DOI":"10.1109\/mm.2025.3526048","type":"journal-article","created":{"date-parts":[[2025,1,7]],"date-time":"2025-01-07T19:30:48Z","timestamp":1736278248000},"page":"26-34","source":"Crossref","is-referenced-by-count":7,"title":["UCIe Standard: Enhancing Die-to-Die Connectivity in Modern Packaging"],"prefix":"10.1109","volume":"45","author":[{"ORCID":"https:\/\/orcid.org\/0009-0005-8054-3674","authenticated-orcid":false,"given":"Au","family":"Huynh","sequence":"first","affiliation":[{"name":"Synopsys, Hô Chí Minh, Vietnam"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-7562-7024","authenticated-orcid":false,"given":"Kent","family":"Stahn","sequence":"additional","affiliation":[{"name":"Synopsys, Ottawa, ON, Canada"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-7507-6495","authenticated-orcid":false,"given":"Manuel","family":"Mota","sequence":"additional","affiliation":[{"name":"Synopsys, Moreira Da Maia, Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-7271-0034","authenticated-orcid":false,"given":"Christian","family":"de Verteuil","sequence":"additional","affiliation":[{"name":"Synopsys, Hillsboro, OR, USA"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-2513-5351","authenticated-orcid":false,"given":"Jennifer","family":"Pyon","sequence":"additional","affiliation":[{"name":"Synopsys, Ottawa, ON, Canada"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-1643-330X","authenticated-orcid":false,"given":"Reza","family":"Movahedinia","sequence":"additional","affiliation":[{"name":"Synopsys, Ottawa, ON, Canada"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ectc51909.2023.00176"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1147\/rd.82.0087"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.23919\/vlsit.2019.8776486"},{"issue":"3","key":"ref4","first-page":"16","article-title":"A cost-effective platform for heterogeneous 2.5 D ICs","volume":"18","author":"Katti","year":"2014","journal-title":"Chip Scale Rev."},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/edaps58880.2023.10468369"},{"key":"ref6","volume-title":"Universal chiplet interconnect express (UCIe) specification rev 1.0","year":"2022"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/tcpmt.2022.3207195"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2017.2737644"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ectc.2016.201"},{"key":"ref10","volume-title":"High frequency structure simulation (HFSS)","year":"2015"}],"container-title":["IEEE Micro"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/40\/10916411\/10832567.pdf?arnumber=10832567","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,7]],"date-time":"2025-03-07T18:39:25Z","timestamp":1741372765000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10832567\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,1]]},"references-count":10,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/mm.2025.3526048","relation":{},"ISSN":["0272-1732","1937-4143"],"issn-type":[{"value":"0272-1732","type":"print"},{"value":"1937-4143","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,1]]}}}