{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,8]],"date-time":"2025-03-08T05:29:26Z","timestamp":1741411766503,"version":"3.38.0"},"reference-count":0,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-009"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-001"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Micro"],"published-print":{"date-parts":[[2025,1]]},"DOI":"10.1109\/mm.2025.3534457","type":"journal-article","created":{"date-parts":[[2025,3,6]],"date-time":"2025-03-06T18:40:18Z","timestamp":1741286418000},"page":"6-8","source":"Crossref","is-referenced-by-count":0,"title":["Special Issue on Interconnects for Chiplet Integration Technologies"],"prefix":"10.1109","volume":"45","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1530-7788","authenticated-orcid":false,"given":"Debendra Das","family":"Sharma","sequence":"first","affiliation":[{"name":"Intel Corporation, Santa Clara, CA, USA"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0442-5634","authenticated-orcid":false,"given":"Nam Sung","family":"Kim","sequence":"additional","affiliation":[{"name":"University of Illinois, Urbana-Champaign, Urbana, IL, USA"}]}],"member":"263","container-title":["IEEE Micro"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/40\/10916411\/10915740.pdf?arnumber=10915740","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,7]],"date-time":"2025-03-07T18:39:31Z","timestamp":1741372771000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10915740\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,1]]},"references-count":0,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/mm.2025.3534457","relation":{},"ISSN":["0272-1732","1937-4143"],"issn-type":[{"type":"print","value":"0272-1732"},{"type":"electronic","value":"1937-4143"}],"subject":[],"published":{"date-parts":[[2025,1]]}}}