{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,11]],"date-time":"2025-11-11T13:19:15Z","timestamp":1762867155818,"version":"3.28.0"},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,5]]},"DOI":"10.1109\/mocast.2017.7937671","type":"proceedings-article","created":{"date-parts":[[2017,6,1]],"date-time":"2017-06-01T20:22:12Z","timestamp":1496348532000},"page":"1-4","source":"Crossref","is-referenced-by-count":8,"title":["Oscillation-based technique for TSV post-bond test considerations"],"prefix":"10.1109","author":[{"given":"Stylianos-Georgios","family":"Papadopoulos","sequence":"first","affiliation":[]},{"given":"Vasileios","family":"Gerakis","sequence":"additional","affiliation":[]},{"given":"Alkis","family":"Hatzopoulos","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"crossref","first-page":"711","DOI":"10.1109\/TVLSI.2011.2107924","article-title":"TSV redundancy: architecture and design issues in 3-D IC","volume":"20","author":"ang-chih","year":"2012","journal-title":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems"},{"key":"ref11","doi-asserted-by":"crossref","first-page":"256","DOI":"10.1109\/TED.2009.2034508","article-title":"Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs","volume":"57","author":"katti","year":"2012","journal-title":"IEEE Trans on Electron Devices"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2011.6100237"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2187543"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2236837"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6248967"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"43","DOI":"10.1109\/JPROC.2008.2007462","article-title":"Through-Silicon Via","author":"motoyoshi","year":"2009","journal-title":"Proceedings of the IEEE"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2010.5457087"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2012.6233037"},{"key":"ref8","article-title":"TSV open defects in 3D integrated circuits: Characterization, test, and optimal spare allocation","author":"fangming","year":"2012","journal-title":"Proceedings of the 49th Annual Design Automation Conference ACM"},{"key":"ref7","first-page":"1","article-title":"Factors Affecting Copper Filling Process Within High Aspect Ratio Deep Vias for 3D Chip Stacking","author":"kim","year":"2006","journal-title":"Electronic Components and Technology Conference"},{"key":"ref2","first-page":"20","article-title":"Designing Supercomputers","author":"yoshimi","year":"2016","journal-title":"ANSYS Advantage"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.873612"},{"key":"ref9","article-title":"Diagnostic Tests for Pre-Bond TSV Defects","author":"bei","year":"2015","journal-title":"2015 28th International Conference on VLSI Design IEEE"}],"event":{"name":"2017 6th International Conference on Modern Circuits and Systems Technologies (MOCAST)","start":{"date-parts":[[2017,5,4]]},"location":"Thessaloniki, Greece","end":{"date-parts":[[2017,5,6]]}},"container-title":["2017 6th International Conference on Modern Circuits and Systems Technologies (MOCAST)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7934471\/7937608\/07937671.pdf?arnumber=7937671","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,25]],"date-time":"2019-09-25T11:40:32Z","timestamp":1569411632000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7937671\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,5]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/mocast.2017.7937671","relation":{},"subject":[],"published":{"date-parts":[[2017,5]]}}}