{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,29]],"date-time":"2026-04-29T21:53:14Z","timestamp":1777499594222,"version":"3.51.4"},"reference-count":17,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2014,3,1]],"date-time":"2014-03-01T00:00:00Z","timestamp":1393632000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Veh. Technol. Mag."],"published-print":{"date-parts":[[2014,3]]},"DOI":"10.1109\/mvt.2013.2295069","type":"journal-article","created":{"date-parts":[[2014,3,4]],"date-time":"2014-03-04T19:02:37Z","timestamp":1393959757000},"page":"64-70","source":"Crossref","is-referenced-by-count":796,"title":["The Tactile Internet: Applications and Challenges"],"prefix":"10.1109","volume":"9","author":[{"given":"Gerhard P.","family":"Fettweis","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"131","article-title":"Teleimmersion","author":"defanti","year":"0","journal-title":"The Grid Blueprint for a New Computing Infrastructure"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2014.6736754"},{"key":"ref12","author":"burdea","year":"2003","journal-title":"Virtual Reality Technology"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2011.2182100"},{"key":"ref14","article-title":"Die Auferstehung, Die Zeit","year":"2013"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/1201775.882309"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9780511783029"},{"key":"ref17","article-title":"The Tactile Internet&#x2014;Enabled by 5G","author":"fettweis","year":"2013"},{"key":"ref4","article-title":"International Technology Roadmap for Semiconductors","year":"2012"},{"key":"ref3","first-page":"24","article-title":"A 5G wireless communications vision","author":"fettweis","year":"2012","journal-title":"Microwave J"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2013.6702314"},{"key":"ref5","article-title":"Keynote, IEEE IEDM","author":"hwang","year":"2006"},{"key":"ref8","article-title":"LTE: The move to global cellular broadband","author":"fettweis","year":"0","journal-title":"Foreword Intel Tech J"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176577"},{"key":"ref2","article-title":"LTE for utilities&#x2014;Supporting smart grids","year":"2013","journal-title":"Ericsson"},{"key":"ref1","article-title":"Mobile Technologies&#x2014;The digital fabric of our lives","year":"2013"},{"key":"ref9","author":"johnson","year":"2010","journal-title":"Designing with the Mind in Mind"}],"container-title":["IEEE Vehicular Technology Magazine"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10209\/6755584\/06755599.pdf?arnumber=6755599","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:30:40Z","timestamp":1642005040000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6755599\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,3]]},"references-count":17,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/mvt.2013.2295069","relation":{},"ISSN":["1556-6072"],"issn-type":[{"value":"1556-6072","type":"print"}],"subject":[],"published":{"date-parts":[[2014,3]]}}}