{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,18]],"date-time":"2026-08-18T00:23:24Z","timestamp":1787012604591,"version":"build-2736575974"},"reference-count":15,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Research Fund of Southeast University, China","award":["RF1028623309"],"award-info":[{"award-number":["RF1028623309"]}]},{"DOI":"10.13039\/501100004826","name":"Beijing Natural Science Foundation","doi-asserted-by":"publisher","award":["L243002"],"award-info":[{"award-number":["L243002"]}],"id":[{"id":"10.13039\/501100004826","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["L243002"],"award-info":[{"award-number":["L243002"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["2024M760433"],"award-info":[{"award-number":["2024M760433"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Veh. Technol. Mag."],"published-print":{"date-parts":[[2025,9]]},"DOI":"10.1109\/mvt.2025.3565848","type":"journal-article","created":{"date-parts":[[2025,5,23]],"date-time":"2025-05-23T13:03:37Z","timestamp":1748005417000},"page":"87-96","source":"Crossref","is-referenced-by-count":6,"title":["Near-Field Channel Characterization for Midband ELAA Systems: Sounding, Parameter Estimation, and Modeling"],"prefix":"10.1109","volume":"20","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9835-4485","authenticated-orcid":false,"given":"Wei","family":"Fan","sequence":"first","affiliation":[{"name":"Southeast University, Nanjing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4957-1651","authenticated-orcid":false,"given":"Zhiqiang","family":"Yuan","sequence":"additional","affiliation":[{"name":"Southeast University, Nanjing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5420-7731","authenticated-orcid":false,"given":"Yejian","family":"Lyu","sequence":"additional","affiliation":[{"name":"Terahertz Wireless Communications (TWC) Laboratory, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6492-3846","authenticated-orcid":false,"given":"Jianhua","family":"Zhang","sequence":"additional","affiliation":[{"name":"Beijing University of Posts and Telecommunications, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jonathan","family":"Borrill","sequence":"additional","affiliation":[{"name":"Anritsu Corporation, Stockholm, Sweden"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0957-1232","authenticated-orcid":false,"given":"Fengchun","family":"Zhang","sequence":"additional","affiliation":[{"name":"Aalborg University, Aalborg, Denmark"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/mcom.2016.7402270"},{"key":"ref2","article-title":"Channel modeling for new spectrum,","volume-title":"3GPP RAN Rel-19 Workshop","year":"2023"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/twc.2015.2414413"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tap.2022.3218759"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/mwc.001.1900157"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/glocomw.2014.7063445"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/tap.2024.3412187"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/tmtt.2019.2910109"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/twc.2022.3184929"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/eucap.2012.6206081"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/tcomm.2019.2916700"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/globecom38437.2019.9013241"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/twc.2017.2725260"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/mcom.001.2200969"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/tmtt.2006.871990"}],"container-title":["IEEE Vehicular Technology Magazine"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10209\/11163520\/11012714.pdf?arnumber=11012714","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,16]],"date-time":"2025-09-16T17:33:17Z","timestamp":1758043997000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11012714\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,9]]},"references-count":15,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/mvt.2025.3565848","relation":{},"ISSN":["1556-6072","1556-6080"],"issn-type":[{"value":"1556-6072","type":"print"},{"value":"1556-6080","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,9]]}}}