{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T12:04:54Z","timestamp":1759147494180,"version":"3.28.0"},"reference-count":13,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,8]]},"DOI":"10.1109\/mwscas.2014.6908392","type":"proceedings-article","created":{"date-parts":[[2014,9,30]],"date-time":"2014-09-30T14:54:51Z","timestamp":1412088891000},"page":"222-225","source":"Crossref","is-referenced-by-count":1,"title":["Yield aware inter-logic-layer communication in 3-D ICs: Early design stage recommendations"],"prefix":"10.1109","author":[{"given":"W.","family":"Gul","sequence":"first","affiliation":[]},{"given":"S. R.","family":"Hasan","sequence":"additional","affiliation":[]},{"given":"O.","family":"Hasan","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/82.917781"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.875789"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS.2014.6934086"},{"key":"3","first-page":"1393","article-title":"Analyzing 3D IC PDNs using multiple clock domains to obtain worst-case power supply noise and temperature variations","volume":"4","author":"mallikarjun","year":"2013","journal-title":"International Journal of Scientific and Engineering Research (IJSER)"},{"key":"2","first-page":"2221","article-title":"Skew variability in 3-D ICs with multiple clock domains","author":"pavlidis","year":"2011","journal-title":"IEEE International Symposium on Circuit and Systems (ISCAS) IEEE"},{"key":"1","first-page":"406","article-title":"3-D ICs: Motivation, performance analysis, and technology","author":"saraswat","year":"2000","journal-title":"Proceedings of the 26th European Solid-State Circuits Conference ESSCIRC"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2007.151"},{"key":"7","first-page":"166","article-title":"TSV redundancy: Architecture and design issues in 3D IC","author":"hsieh","year":"2010","journal-title":"Proceedings of IEEE\/ACM Design Automation and Test in Europe IEEE Dresden"},{"key":"6","first-page":"1486","article-title":"An enhanced double-TSV scheme for defect tolerance in 3-D IC","author":"shih","year":"2013","journal-title":"Proc of Design Automation and Test in Euorope Conference and Exhibition (DATE) IEEE"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6165052"},{"key":"4","doi-asserted-by":"crossref","first-page":"273","DOI":"10.1145\/2429384.2429438","article-title":"Test challenges in designing complex 3D chips: What in on the horizon for EDA industry?: Desiging track","author":"goel","year":"2012","journal-title":"Proc of International Conference on Computer Aided Design (ICAAD) IEEE"},{"key":"9","article-title":"On effective TSV repair for 3D-stacked ICs","author":"jiang","year":"2012","journal-title":"Proceedings of IEEE\/ACM Design Automation and Test in Europe IEEE Dresden"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"}],"event":{"name":"2014 IEEE 57th International Midwest Symposium on Circuits and Systems (MWSCAS)","start":{"date-parts":[[2014,8,3]]},"location":"College Station, TX, USA","end":{"date-parts":[[2014,8,6]]}},"container-title":["2014 IEEE 57th International Midwest Symposium on Circuits and Systems (MWSCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6900043\/6908326\/06908392.pdf?arnumber=6908392","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,18]],"date-time":"2022-04-18T11:48:56Z","timestamp":1650282536000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6908392\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,8]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/mwscas.2014.6908392","relation":{},"subject":[],"published":{"date-parts":[[2014,8]]}}}