{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T06:48:43Z","timestamp":1725518923518},"reference-count":13,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,8]]},"DOI":"10.1109\/mwscas.2014.6908464","type":"proceedings-article","created":{"date-parts":[[2014,9,30]],"date-time":"2014-09-30T10:54:51Z","timestamp":1412074491000},"page":"511-514","source":"Crossref","is-referenced-by-count":0,"title":["Post-silicon tuning aware wafer matching algorithm for 3d integration of ICs"],"prefix":"10.1109","author":[{"given":"Sangdo","family":"Park","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Taewhan","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Predictive Technology Model","year":"2011","key":"13"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1002\/nav.3800020109"},{"journal-title":"ISPD 2009 Clock Network Synthesis Contest","year":"2009","key":"12"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2009.4810285"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2008.4672172"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687524"},{"key":"10","first-page":"143","article-title":"Die matching algorithm for enhancing parametric yield of 3d ics","author":"park","year":"2012","journal-title":"IEEE International SOC Conference Nov"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1145\/1412587.1412592"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2003513"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837312"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1145\/1594233.1594303"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.5573\/JSTS.2012.12.2.139"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6164958"}],"event":{"name":"2014 IEEE 57th International Midwest Symposium on Circuits and Systems (MWSCAS)","start":{"date-parts":[[2014,8,3]]},"location":"College Station, TX, USA","end":{"date-parts":[[2014,8,6]]}},"container-title":["2014 IEEE 57th International Midwest Symposium on Circuits and Systems (MWSCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6900043\/6908326\/06908464.pdf?arnumber=6908464","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,10,14]],"date-time":"2020-10-14T12:01:01Z","timestamp":1602676861000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6908464"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,8]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/mwscas.2014.6908464","relation":{},"subject":[],"published":{"date-parts":[[2014,8]]}}}