{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T11:19:02Z","timestamp":1725794342184},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,8]]},"DOI":"10.1109\/mwscas.2017.8052860","type":"proceedings-article","created":{"date-parts":[[2017,10,24]],"date-time":"2017-10-24T20:21:31Z","timestamp":1508876491000},"page":"60-63","source":"Crossref","is-referenced-by-count":10,"title":["A system-on-chip NFC bicycle tire pressure measurement system"],"prefix":"10.1109","author":[{"given":"Carolin","family":"Kollegger","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Philipp","family":"Greiner","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Christoph","family":"Steffan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Martin","family":"Wiessflecker","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Heiko","family":"Froehlich","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Thoralf","family":"Kautzsch","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gerald","family":"Holweg","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bernd","family":"Deutschmann","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1007\/s00502-015-0381-7"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/URAI.2015.7358842"},{"journal-title":"Method for manufacturing a micromechanical system comprising a removal of sacrificial material through a hole in a margin region","year":"2014","author":"kautzsch","key":"ref10"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS.2012.6291967"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2012.6271903"},{"journal-title":"Pressure sensor unit","year":"1999","author":"shiono","key":"ref8"},{"journal-title":"Method of removing sealant used for the protection of electric or electronic part","year":"2003","author":"fukuda","key":"ref7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MCS.2007.909477"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TEPM.2003.820802"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/WICOM.2007.625"}],"event":{"name":"2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS)","start":{"date-parts":[[2017,8,6]]},"location":"Boston, MA, USA","end":{"date-parts":[[2017,8,9]]}},"container-title":["2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8039346\/8052834\/08052860.pdf?arnumber=8052860","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,25]],"date-time":"2022-01-25T22:23:58Z","timestamp":1643149438000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8052860\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,8]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/mwscas.2017.8052860","relation":{},"subject":[],"published":{"date-parts":[[2017,8]]}}}