{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T16:08:12Z","timestamp":1729613292130,"version":"3.28.0"},"reference-count":19,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,8]]},"DOI":"10.1109\/mwscas.2017.8053091","type":"proceedings-article","created":{"date-parts":[[2017,10,24]],"date-time":"2017-10-24T16:21:31Z","timestamp":1508862091000},"page":"985-988","source":"Crossref","is-referenced-by-count":2,"title":["On-chip thermal management method based on phase change material"],"prefix":"10.1109","author":[{"given":"Jingyan","family":"Fu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Seyed Alireza","family":"Pourbakhsh","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaowei","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mingli","family":"Li","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhibin","family":"Lin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ligang","family":"Hou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Frederik","family":"Haring","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Na","family":"Gong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jinhui","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijthermalsci.2014.10.012"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.icheatmasstransfer.2009.01.015"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/HOTCHIPS.2014.7478801"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1080\/15567030903117679"},{"key":"ref14","first-page":"129","article-title":"Thermophysical comparison of five commercial paraffin waxes as latent heat storage materials","author":"neven","year":"2010","journal-title":"Chemical and biochemical engineering quarterly 24 2"},{"key":"ref15","first-page":"2822","article-title":"Application of phase change materials in thermal management of electronics","author":"ravi","year":"2007","journal-title":"Applied Thermal Engineering 27 17"},{"key":"ref16","first-page":"855","article-title":"Numerical study of phase change material based orthotropic heat sink for thermal management of electronics components","author":"santosh","year":"2016","journal-title":"International Journal Heat and Mass Transfer"},{"key":"ref17","first-page":"212","article-title":"Thermal performance of heat spreader for electronics cooling with incorporated phase change material","author":"maciej","year":"2012","journal-title":"Applied Thermal Engineering 35"},{"key":"ref18","first-page":"103","article-title":"Experimental study of the cooling performance of phase change material with discrete heat sources-Continuous and intermittent regimes","author":"salma","year":"2017","journal-title":"Applied Thermal Engineering 111"},{"key":"ref19","first-page":"143","article-title":"Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction","author":"adeel","year":"2017","journal-title":"Applied Thermal Engineering 112"},{"key":"ref4","doi-asserted-by":"crossref","first-page":"1642","DOI":"10.1016\/j.ijheatmasstransfer.2011.11.020","article-title":"Experimental investigations on phase change material based finned heat sinks for electronic equipment cooling","volume":"55","author":"rajesh","year":"2012","journal-title":"International Journal of Heat and Mass Transfer"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2005.848534"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2005.848534"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2014.6974690"},{"key":"ref8","doi-asserted-by":"crossref","first-page":"1195","DOI":"10.1016\/j.mejo.2015.09.022","article-title":"Characterization of phase change material systems using a thermal test device","volume":"46","author":"xavier","year":"2015","journal-title":"Microelectronics Journal"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"143","DOI":"10.1016\/j.applthermaleng.2016.10.090","article-title":"Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction","volume":"112","author":"adeel","year":"2017","journal-title":"Applied Thermal Engineering"},{"key":"ref2","article-title":"IC Packaging: 3D IC Technology and Methods","author":"adesh","year":"2017","journal-title":"Proceedings of the International Conference on Nano-electronics Circuits & Communication Systems"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2011.60"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2013.2265753"}],"event":{"name":"2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS)","start":{"date-parts":[[2017,8,6]]},"location":"Boston, MA, USA","end":{"date-parts":[[2017,8,9]]}},"container-title":["2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8039346\/8052834\/08053091.pdf?arnumber=8053091","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,10,4]],"date-time":"2019-10-04T23:17:00Z","timestamp":1570231020000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8053091\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,8]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/mwscas.2017.8053091","relation":{},"subject":[],"published":{"date-parts":[[2017,8]]}}}